Inventor · disambiguated record
Zhiping Yang
Also filed as: YANG ZHIPING
23 granted patents·8 pending applications·158 citations·filing 2003–2025
94Inventor score
Top patents by PatentIndex Score
31 records- 0194US8727793B2Optical module design in an SFP form factor to support increased rates of data transmissionCAFIERO LUCA·Filed 2011·Granted May 20, 2014·35 cites·24 claims
- 0282US7262974B2Techniques for alleviating the need for DC blocking capacitors in high-speed differential signal pairsCISCO TECH INC·Filed 2005·Granted Aug 28, 2007·14 cites·24 claims
- 0381US9414497B2Semiconductor package including an embedded circuit component within a support structure of the packageCISCO TECH INC·Filed 2015·Granted Aug 9, 2016·3 cites·16 claims
- 0481US9087846B2Systems and methods for high-speed, low-profile memory packages and pinout designsAPPLE INC·Filed 2013·Granted Jul 21, 2015·4 cites·10 claims
- 0580US10002101B2Methods and apparatus for equalization of a high speed serial busAPPLE INC·Filed 2015·Granted Jun 19, 2018·4 cites·19 claims
- 0680US7254032B1Techniques for providing EMI shielding within a circuit board componentCISCO TECH INC·Filed 2004·Granted Aug 7, 2007·29 cites·21 claims
- 0779US7486702B1DDR interface for reducing SSO/SSI noiseCISCO TECH INC·Filed 2003·Granted Feb 3, 2009·29 cites·9 claims
- 0877US9466571B2Systems and methods for high-speed, low-profile memory packages and pinout designsAPPLE INC·Filed 2015·Granted Oct 11, 2016·2 cites·9 claims
- 0976US6992374B1Techniques for manufacturing a circuit board with an improved layout for decoupling capacitorsCISCO TECH IND·Filed 2004·Granted Jan 31, 2006·21 cites·16 claims
- 1073US9129908B2Manufacturing a semiconductor package including an embedded circuit component within a support structure of the packageSAVIC JOVICA·Filed 2011·Granted Sep 8, 2015·3 cites·20 claims
- 1171US9853016B2Systems and methods for high-speed, low-profile memory packages and pinout designsAPPLE INC·Filed 2017·Granted Dec 26, 2017·1 cites·16 claims
- 1270US7675147B1Methods and apparatus for providing a power signal to an area array packageCISCO TECH INC·Filed 2007·Granted Mar 9, 2010·4 cites·8 claims
- 1369US12501553B2Methods and systems for configuring conductive paths in a printed circuit board assembly (PCBA) for enhanced power distributionPCB AUTOMATION INC·Filed 2025·Granted Dec 16, 2025·0 cites·20 claims
- 1464USD1071566SCleansing brushDONGGUAN MIQIANG TECH CO LTD·Filed 2023·Granted Apr 22, 2025·2 cites·1 claims
- 1562US10296773B2Capacitive sensing array having electrical isolationAPPLE INC·Filed 2013·Granted May 21, 2019·1 cites·21 claims
- 1661US7360307B2Techniques for manufacturing a circuit board with an improved layout for decoupling capacitorsCISCO TECH INC·Filed 2005·Granted Apr 22, 2008·2 cites·13 claims
- 1761US2025280500A1Methods and systems for configuring conductive paths in a printed circuit board assembly (pcba) for enhanced power distributionPCB AUTOMATION INC·Filed 2025·Application pending·0 cites
- 1860US10628654B2Capacitive sensing array having electrical isolationAPPLE INC·Filed 2019·Granted Apr 21, 2020·0 cites·20 claims
- 1957US7924911B2Techniques for simulating a decision feedback equalizer circuitCISCO TECH INC·Filed 2005·Granted Apr 12, 2011·1 cites·19 claims
- 2056US11329414B2Conductive receptacle collar for desense mitigationGOOGLE LLC·Filed 2020·Granted May 10, 2022·0 cites·12 claims
- 2155US9583452B2Systems and methods for high-speed, low-profile memory packages and pinout designsAPPLE INC·Filed 2016·Granted Feb 28, 2017·0 cites·17 claims
- 2254USD1064405SAutomatic curling ironDONGGUAN MIQIANG TECH CO LTD·Filed 2023·Granted Feb 25, 2025·1 cites·1 claims
- 2351US12474419B2Device based on ensemble nitrogen-vacancy centersUNIV SCIENCE & TECHNOLOGY CHINA·Filed 2022·Granted Nov 18, 2025·0 cites·8 claims
- 2448US2011153536A1Computer-Implemented Systems And Methods For Dynamic Model Switching Simulation Of Risk FactorsYANG ZHIPING·Filed 2009·Application pending·0 cites
- 2547US7303941B1Methods and apparatus for providing a power signal to an area array packageCISCO TECH INC·Filed 2004·Granted Dec 4, 2007·2 cites·10 claims
- 2647US2011167020A1Hybrid Simulation Methodologies To Simulate Risk FactorsYANG ZHIPING·Filed 2010·Application pending·0 cites
- 2741US2014264904A1Unified pcb design for ssd applications, various density configurations, and direct nand accessAPPLE INC·Filed 2013·Application pending·0 cites
- 2841US2015216731A1Ear warmer frame180S INC·Filed 2014·Application pending·0 cites
- 2938US2020350733A1Shield for preventing interference from electrical connectorGOOGLE LLC·Filed 2019·Application pending·0 cites
- 3038US2013015557A1Semiconductor package including an external circuit elementYANG ZHIPING·Filed 2011·Application pending·0 cites
- 3137US2016283621A1Hybrid Simulation MethodologiesSAS INST INC·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →