Inventor · disambiguated record
Yutaka Satou
Also filed as: SATOU YUTAKA
34 granted patents·7 pending applications·63 citations·filing 2005–2023
95Inventor score
Top patents by PatentIndex Score
41 records- 0189US7440267B2Electronic apparatusFUJITSU LTD·Filed 2005·Granted Oct 21, 2008·24 cites·11 claims
- 0288US8512466B2Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring boardHAYASHI KOJI·Filed 2011·Granted Aug 20, 2013·4 cites·12 claims
- 0379US7349201B2Electronic apparatusFUJITSU LTD·Filed 2005·Granted Mar 25, 2008·11 cites·11 claims
- 0473US12103376B2AutomobileNISSAN MOTOR·Filed 2019·Granted Oct 1, 2024·3 cites·5 claims
- 0573US7985822B2Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resinDAINIPPON INK & CHEMICALS·Filed 2005·Granted Jul 26, 2011·5 cites·2 claims
- 0671US11348855B2Semiconductor component and power moduleCALSONIC KANSEI CORP·Filed 2017·Granted May 31, 2022·2 cites·14 claims
- 0769US8168731B2Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the sameSATOU YUTAKA·Filed 2009·Granted May 1, 2012·4 cites·18 claims
- 0868US8360752B2Electric compressorCALSONIC KANSEI CORP·Filed 2008·Granted Jan 29, 2013·3 cites·3 claims
- 0967US9765173B2Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Sep 19, 2017·2 cites·8 claims
- 1065US8263714B2Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resinOGURA ICHIRO·Filed 2011·Granted Sep 11, 2012·2 cites·6 claims
- 1161US2025300532A1Manufacturing apparatus and manufacturing method for hairpin conductorAMADA CO LTD·Filed 2023·Application pending·0 cites
- 1260US10113028B2Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded articleDAINIPPON INK & CHEMICALS·Filed 2015·Granted Oct 30, 2018·1 cites·13 claims
- 1360US9045508B2Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring boardDAINIPPON INK & CHEMICALS·Filed 2013·Granted Jun 2, 2015·0 cites·1 claims
- 1458US11548977B2Active ester resin and composition and cured product using the sameDAINIPPON INK & CHEMICALS·Filed 2018·Granted Jan 10, 2023·0 cites·10 claims
- 1555US2009104055A1Electric compressor manufacturing method and electric compressorCALSONIC KANSEI CORP·Filed 2008·Application pending·0 cites
- 1654US8519065B2Epoxy compound, curable composition, and cured product thereofSATOU YUTAKA·Filed 2011·Granted Aug 27, 2013·0 cites·7 claims
- 1751US9736926B2Epoxy resin, curable resin composition, cured product thereof, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2013·Granted Aug 15, 2017·0 cites·16 claims
- 1850US9890237B2Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Feb 13, 2018·0 cites·8 claims
- 1949US7835188B2Semiconductor memory deviceSEIKO INSTR INC·Filed 2009·Granted Nov 16, 2010·2 cites·16 claims
- 2048US11901249B2Curable composition and cured product thereofDAINIPPON INK & CHEMICALS·Filed 2019·Granted Feb 13, 2024·0 cites·18 claims
- 2148US9056990B2Phosphorus-atom-containing oligomer composition, curable resin composition, cured product thereof, and printed circuit boardHAYASHI KOJI·Filed 2012·Granted Jun 16, 2015·0 cites·6 claims
- 2247US11873356B2Curable composition and cured product thereofDAINIPPON INK & CHEMICALS·Filed 2019·Granted Jan 16, 2024·0 cites·5 claims
- 2347US2010074773A1Electric compressorCALSONIC KANSEI CORP·Filed 2008·Application pending·0 cites
- 2445US11053384B2Curable composition and cured product thereofDAINIPPON INK & CHEMICALS·Filed 2017·Granted Jul 6, 2021·0 cites·9 claims
- 2545US10615156B2Power moduleCALSONIC KANSEI CORP·Filed 2017·Granted Apr 7, 2020·0 cites·7 claims
- 2645US9125309B2Epoxy resin, curable resin composition and cured product thereof, and printed wiring boardSATOU YUTAKA·Filed 2012·Granted Sep 1, 2015·0 cites·16 claims
- 2745US8394911B2Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit boardSATOU YUTAKA·Filed 2011·Granted Mar 12, 2013·0 cites·16 claims
- 2843US11299448B2Active ester compoundDAINIPPON INK & CHEMICALS·Filed 2018·Granted Apr 12, 2022·0 cites·9 claims
- 2943US10081585B2Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Sep 25, 2018·0 cites·6 claims
- 3043US10011676B2Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Jul 3, 2018·0 cites·5 claims
- 3143US2015252136A1Epoxy resin, curable resin composition, cured product thereof, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2013·Application pending·0 cites
- 3242US10435382B2Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Oct 8, 2019·0 cites·7 claims
- 3342US2013131215A1Novel phenol resin, curable resin composition, cured article thereof, and printed wiring boardSATOU YUTAKA·Filed 2011·Application pending·0 cites
- 3439US11322790B2Prismatic secondary batteryVEHICLE ENERGY JAPAN INC·Filed 2017·Granted May 3, 2022·0 cites·17 claims
- 3538US11407708B2Active ester compound and composition and cured product obtained using the sameDAINIPPON INK & CHEMICALS·Filed 2018·Granted Aug 9, 2022·0 cites·9 claims
- 3638US9580634B2Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealantDAINIPPON INK & CHEMICALS·Filed 2013·Granted Feb 28, 2017·0 cites·18 claims
- 3737US9902798B2Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit boardDAINIPPON INK & CHEMICALS·Filed 2014·Granted Feb 27, 2018·0 cites·6 claims
- 3834US10800914B2Active ester composition and cured product thereofDAINIPPON INK & CHEMICALS·Filed 2017·Granted Oct 13, 2020·0 cites·10 claims
- 3934US10741464B2Active ester resin and cured product thereofDAINIPPON INK & CHEMICALS·Filed 2017·Granted Aug 11, 2020·0 cites·20 claims
- 4034US2019225744A1Active ester resin composition and cured product of sameDAINIPPON INK & CHEMICALS·Filed 2017·Application pending·0 cites
- 4133US2021139641A1Active ester composition and semiconductor sealing materialDAINIPPON INK & CHEMICALS·Filed 2018·Application pending·0 cites
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