Inventor · disambiguated record
Yin Yen Bong
Also filed as: BONG YIN Y · BONG YIN YEN
4 granted patents·3 pending applications·428 citations·filing 2000–2004
83Inventor score
Top patents by PatentIndex Score
7 records- 0194US6399415B1Electrical isolation in panels of leadless IC packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jun 4, 2002·145 cites·10 claims
- 0292US6452255B1Low inductance leadless packageNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 17, 2002·103 cites·11 claims
- 0389US7462942B2Die pillar structures and a method of their formationADVANPACK SOLUTIONS PTE LTD·Filed 2003·Granted Dec 9, 2008·149 cites·59 claims
- 0478US6686652B1Locking lead tips and die attach pad for a leadless package apparatus and methodNAT SEMICONDUCTOR CORP·Filed 2000·Granted Feb 3, 2004·31 cites·29 claims
- 0538US2006060937A1Embedded passive componentADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
- 0636US2006097346A1Structure for high quality factor inductor operationADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
- 0735US2005167797A1Structure packageADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →