Inventor · disambiguated record
Ikue Yokomizo
Also filed as: YOKOMIZO IKUE
3 granted patents·36 citations·filing 2019–2021
68Inventor score
Top patents by PatentIndex Score
3 records- 0195US10790296B1Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layerSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Sep 29, 2020·19 cites·20 claims
- 0294US10797035B1Bonded assembly containing side bonding structures and methods of manufacturing the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Oct 6, 2020·16 cites·20 claims
- 0384US11569139B2Electrical overlay measurement methods and structures for wafer-to-wafer bondingWESTERN DIGITAL TECH INC·Filed 2021·Granted Jan 31, 2023·1 cites·3 claims
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