Inventor · disambiguated record
Takashi Yamaha
Also filed as: YAMAHA TAKASHI
5 granted patents·1 pending application·38 citations·filing 2019–2023
75Inventor score
Top patents by PatentIndex Score
6 records- 0195US10790296B1Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layerSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Sep 29, 2020·19 cites·20 claims
- 0294US10797035B1Bonded assembly containing side bonding structures and methods of manufacturing the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Oct 6, 2020·16 cites·20 claims
- 0389US12213320B2Three-dimensional memory device with finned support pillar structures and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Jan 28, 2025·2 cites·20 claims
- 0484US11569139B2Electrical overlay measurement methods and structures for wafer-to-wafer bondingWESTERN DIGITAL TECH INC·Filed 2021·Granted Jan 31, 2023·1 cites·3 claims
- 0558US12456688B2High aspect ratio via fill process employing selective metal deposition and structures formed by the sameSANDISK TECHNOLOGIES LLC·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 0653US2024213094A1Self-aligned line-and-via structure and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
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