Inventor · disambiguated record
Hongseong Son
Also filed as: SON HONGSEONG
3 granted patents·43 citations·filing 2002–2018
62Inventor score
Top patents by PatentIndex Score
3 records- 0179US6709970B1Method for creating a damascene interconnect using a two-step electroplating processSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 23, 2004·43 cites·22 claims
- 0250US10079164B2System, apparatus, and method for processing substrates using acoustic energyAKRION SYSTEMS LLC·Filed 2014·Granted Sep 18, 2018·0 cites·22 claims
- 0346US10607864B2System, apparatus, and method for processing substrates using acoustic energyNAURA AKRION INC·Filed 2018·Granted Mar 31, 2020·0 cites·16 claims
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