Inventor · disambiguated record
Klaus Wilke
Also filed as: WILKE KLAUS
15 granted patents·14 pending applications·10 citations·filing 2004–2023
86Inventor score
Top patents by PatentIndex Score
29 records- 0179US11285569B2Soldering material based on Sn Ag and CuHENKEL AG & CO KGAA·Filed 2019·Granted Mar 29, 2022·1 cites·10 claims
- 0272US2022168851A1Soldering material based on sn ag and cuHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 0368US2023189450A1Tolerance compensation element for circuit configurationsSIEMENS AG·Filed 2023·Application pending·0 cites
- 0467US11373984B2Power module having a power electronics device on a substrate board, and power electronics circuit having such a power moduleSIEMENS AG·Filed 2019·Granted Jun 28, 2022·1 cites·13 claims
- 0563US11331759B2Solder alloy for power devices and solder joint having a high current densitySENJU METAL INDUSTRY CO·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 0652US11424170B2Method for mounting an electrical component in which a hood is used, and a hood that is suitable for use in this methodSIEMENS AG·Filed 2015·Granted Aug 23, 2022·1 cites·5 claims
- 0752US10008394B2Method for mounting an electrical component, wherein a hood is used, and hood suitable for use in said methodSIEMENS AG·Filed 2015·Granted Jun 26, 2018·1 cites·12 claims
- 0851US10376994B2Soldering material based on Sn Ag and CuALBRECHT HANS JUERGEN·Filed 2004·Granted Aug 13, 2019·6 cites·5 claims
- 0950US2020122450A1Tolerance compensation element for circuit configurationsSIEMENS AG·Filed 2018·Application pending·0 cites
- 1049US12341127B2Semifinished product for populating with components and, method for populating same with componentsSIEMENS AG·Filed 2020·Granted Jun 24, 2025·0 cites·11 claims
- 1149US2025385228A1Power Electronics Assembly Comprising Power Modules That Can Be Fitted with ComponentsSIEMENS AG·Filed 2023·Application pending·0 cites
- 1246US2014112710A1Solder Alloy for Power Devices and Solder Joint Having a High Current DensityALBRECHT HANS-JURGEN·Filed 2012·Application pending·0 cites
- 1346US2024038621A1Device Comprising a Component and a Coupled Cooling BodySIEMENS AG·Filed 2021·Application pending·0 cites
- 1445US11373804B2Capacitor structure and power module having a power electronic componentSIEMENS AG·Filed 2019·Granted Jun 28, 2022·0 cites·13 claims
- 1543US11564310B2Vibration-damped circuit arrangement, converter, and aircraft having such an arrangementROLLS ROYCE DEUTSCHLAND LTD & CO KG·Filed 2019·Granted Jan 24, 2023·0 cites·13 claims
- 1643US2021176885A1Connecting electrical componentsSIEMENS AG·Filed 2019·Application pending·0 cites
- 1743US2023215838A1Joining and Insulating Power Electronic Semiconductor ComponentsSIEMENS AG·Filed 2021·Application pending·0 cites
- 1843US2021098974A1Creation of an electrical connection between components and a contacting plateSIEMENS AG·Filed 2019·Application pending·0 cites
- 1941US11282822B2Power electronic circuit having a plurality of power modulesSIEMENS AG·Filed 2019·Granted Mar 22, 2022·0 cites·15 claims
- 2041US10004147B2Method for the diffusion soldering of an electronic component to a substrateSIEMENS AG·Filed 2014·Granted Jun 19, 2018·0 cites·9 claims
- 2140US11289425B2Semiconductor component and method for producing sameSIEMENS AG·Filed 2018·Granted Mar 29, 2022·0 cites·9 claims
- 2240US11212918B2Electrical assemblySIEMENS AG·Filed 2018·Granted Dec 28, 2021·0 cites·5 claims
- 2340US2020139490A1Solder Preform for Diffusion Soldering, Method for the Production thereof, and Method for the Assembly ThereofSIEMENS AG·Filed 2018·Application pending·0 cites
- 2439US2022285311A1Installing an Electronic AssemblySIEMENS AG·Filed 2020·Application pending·0 cites
- 2538US11285568B2Solder preform for establishing a diffusion solder connection and method for producing a solder preformSIEMENS AG·Filed 2018·Granted Mar 29, 2022·0 cites·14 claims
- 2637US10420220B2Electronic assembly with a component arranged between two circuit carriers, and method for joining such an assemblySIEMENS AG·Filed 2017·Granted Sep 17, 2019·0 cites·14 claims
- 2737US2020152532A1Electronic Assembly With a Component Located Between Two Substrates, and Method for Producing SameSIEMENS AG·Filed 2018·Application pending·0 cites
- 2833US2021021179A1Circuit arrangement having a spacer element, converter and aircraft with such a circuit arrangement, and method for current measurementBLANK RENE·Filed 2019·Application pending·0 cites
- 2932US2021351151A1Circuit Carrier Having an Installation Place for Electronic Components, Electronic Circuit and Production MethodSIEMENS AG·Filed 2019·Application pending·0 cites
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