Inventor · disambiguated record
Benjamin L. Mcclain
Also filed as: MCCLAIN BENJAMIN L
19 granted patents·3 pending applications·30 citations·filing 2017–2024
91Inventor score
Files withMICRON TECHNOLOGY INC22
Top patents by PatentIndex Score
22 records- 0192US11594432B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 28, 2023·2 cites·19 claims
- 0290US10090177B1Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 2, 2018·5 cites·10 claims
- 0386US10950568B2Semiconductor device assembly with surface-mount die support structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 16, 2021·4 cites·6 claims
- 0485US11670612B2Method for solder bridging elimination for bulk solder C2S interconnectsMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 6, 2023·1 cites·14 claims
- 0585US10276539B1Method for 3D ink jet TCB interconnect controlMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·7 cites·18 claims
- 0684US10548230B2Method for stress reduction in semiconductor package via carrierMICRON TECHNOLOGY INC·Filed 2018·Granted Jan 28, 2020·3 cites·18 claims
- 0783US11410962B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·1 cites·22 claims
- 0882US10952333B2Method for stress reduction in semiconductor package via carrierMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
- 0981US10840210B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·2 cites·11 claims
- 1079US2024429191A1Semiconductor device assembly with surface-mount die support structuresMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1178US10840209B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·2 cites·14 claims
- 1276US12080678B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 3, 2024·0 cites·11 claims
- 1376US10410891B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 10, 2019·1 cites·16 claims
- 1468US12087720B2Semiconductor device assembly with surface-mount die support structuresMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 1566US11705425B2Thermocompression bond tips and related apparatus and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·0 cites·18 claims
- 1664US10998208B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted May 4, 2021·0 cites·17 claims
- 1761US11410963B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 1859US2021111132A1Method for Substrate Moisture NCF Voiding EliminationMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 1953US11024595B2Thermocompression bond tips and related apparatus and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 1, 2021·0 cites·19 claims
- 2052US10879195B2Method for substrate moisture NCF voiding eliminationMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 29, 2020·0 cites·10 claims
- 2150US2019067232A1Method for Solder Bridging Elimination for Bulk Solder C2S InterconnectsMICRON TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 2243US10700038B2Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing toolMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 30, 2020·0 cites·25 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →