Inventor · disambiguated record
Angelique Raley
Also filed as: RALEY ANGELIQUE · RALEY ANGELIQUE D · RALEY ANGELIQUE DENISE · RALEY ANGÉLIQUE D
59 granted patents·15 pending applications·605 citations·filing 2011–2025
98Inventor score
Files withTOKYO ELECTRON LTD70RALEY ANGELIQUE DENISE2RANJAN ALOK1TEL MFG AND ENGINEERING OF AMERICA INC1
Top patents by PatentIndex Score
74 records- 0198US9786503B2Method for increasing pattern density in self-aligned patterning schemes without using hard masksTOKYO ELECTRON LTD·Filed 2016·Granted Oct 10, 2017·45 cites·20 claims
- 0297US10354873B2Organic mandrel protection processTOKYO ELECTRON LTD·Filed 2017·Granted Jul 16, 2019·340 cites·20 claims
- 0397US9673059B2Method for increasing pattern density in self-aligned patterning integration schemesTOKYO ELECTRON LTD·Filed 2016·Granted Jun 6, 2017·45 cites·19 claims
- 0496US10916472B2Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using sameTOKYO ELECTRON LTD·Filed 2019·Granted Feb 9, 2021·14 cites·17 claims
- 0596US9111746B2Method for reducing damage to low-k gate spacer during etchingRANJAN ALOK·Filed 2012·Granted Aug 18, 2015·29 cites·17 claims
- 0695US11101173B2Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using sameTOKYO ELECTRON LTD·Filed 2019·Granted Aug 24, 2021·11 cites·27 claims
- 0795US9443731B1Material processing to achieve sub-10nm patterningTOKYO ELECTRON LTD·Filed 2015·Granted Sep 13, 2016·21 cites·20 claims
- 0894US9165765B1Method for patterning differing critical dimensions at sub-resolution scalesTOKYO ELECTRON LTD·Filed 2014·Granted Oct 20, 2015·17 cites·20 claims
- 0994US8906760B2Aspect ratio dependent deposition to improve gate spacer profile, fin-loss and hardmask-loss for FinFET schemeTOKYO ELECTRON LTD·Filed 2013·Granted Dec 9, 2014·19 cites·20 claims
- 1093US11915931B2Extreme ultraviolet lithography patterning methodTOKYO ELECTRON LTD·Filed 2021·Granted Feb 27, 2024·2 cites·20 claims
- 1193US10727057B2Platform and method of operating for integrated end-to-end self-aligned multi-patterning processTOKYO ELECTRON LTD·Filed 2019·Granted Jul 28, 2020·10 cites·20 claims
- 1293US9171736B2Spacer material modification to improve K-value and etch propertiesTOKYO ELECTRON LTD·Filed 2014·Granted Oct 27, 2015·16 cites·17 claims
- 1389US11482454B2Methods for forming self-aligned contacts using spin-on silicon carbideTOKYO ELECTRON LTD·Filed 2021·Granted Oct 25, 2022·2 cites·20 claims
- 1488US11322364B2Method of patterning a metal film with improved sidewall roughnessTOKYO ELECTRON LTD·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 1588US8664125B2Highly selective spacer etch process with reduced sidewall spacer slimmingRALEY ANGELIQUE DENISE·Filed 2011·Granted Mar 4, 2014·12 cites·20 claims
- 1684US11515203B2Selective deposition of conductive cap for fully-aligned-via (FAV)TOKYO ELECTRON LTD·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
- 1784US9748110B2Method and system for selective spacer etch for multi-patterning schemesTOKYO ELECTRON LTD·Filed 2016·Granted Aug 29, 2017·4 cites·10 claims
- 1883US12494369B2Extreme ultraviolet lithography patterning methodTOKYO ELECTRON LTD·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 1982US11978631B2Forming contact holes with controlled local critical dimension uniformityTOKYO ELECTRON LTD·Filed 2020·Granted May 7, 2024·1 cites·22 claims
- 2081US9257280B2Mitigation of asymmetrical profile in self aligned patterning etchTOKYO ELECTRON LTD·Filed 2014·Granted Feb 9, 2016·5 cites·13 claims
- 2180US11424123B2Forming a semiconductor feature using atomic layer etchTOKYO ELECTRON LTD·Filed 2020·Granted Aug 23, 2022·1 cites·20 claims
- 2279US11837471B2Methods of patterning small featuresTOKYO ELECTRON LTD·Filed 2020·Granted Dec 5, 2023·1 cites·18 claims
- 2377US11164781B2ALD (atomic layer deposition) liner for via profile control and related applicationsTOKYO ELECTRON LTD·Filed 2019·Granted Nov 2, 2021·2 cites·20 claims
- 2477US10971372B2Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masksTOKYO ELECTRON LTD·Filed 2016·Granted Apr 6, 2021·2 cites·17 claims
- 2577US2025244663A1Method for reducing lithography defects and pattern transferTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2675US12265326B2Method for reducing lithography defects and pattern transferTOKYO ELECTRON LTD·Filed 2022·Granted Apr 1, 2025·0 cites·12 claims
- 2772US10867854B2Double plug method for tone inversion patterningTOKYO ELECTRON LTD·Filed 2019·Granted Dec 15, 2020·1 cites·18 claims
- 2871US10748769B2Methods and systems for patterning of low aspect ratio stacksTOKYO ELECTRON LTD·Filed 2019·Granted Aug 18, 2020·1 cites·20 claims
- 2968US12080599B2Methods for forming self-aligned contacts using spin-on silicon carbideTOKYO ELECTRON LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 3065US11742241B2ALD (atomic layer deposition) liner for via profile control and related applicationsTOKYO ELECTRON LTD·Filed 2021·Granted Aug 29, 2023·0 cites·19 claims
- 3164US11289325B2Radiation of substrates during processing and systems thereofTOKYO ELECTRON LTD·Filed 2021·Granted Mar 29, 2022·0 cites·16 claims
- 3261US12469701B2Patterning features with metal based resistsTOKYO ELECTRON LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 3361US11538691B2Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masksTOKYO ELECTRON LTD·Filed 2021·Granted Dec 27, 2022·0 cites·16 claims
- 3461US2022189764A1Radiation of Substrates During Processing and Systems ThereofTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3560US2024353751A1Optical elements patterningTEL MFG AND ENGINEERING OF AMERICA INC·Filed 2023·Application pending·0 cites
- 3659US12334391B2Method for patterning a substrate using photolithographyTOKYO ELECTRON LTD·Filed 2021·Granted Jun 17, 2025·0 cites·20 claims
- 3759US11333968B2Method for reducing lithography defects and pattern transferTOKYO ELECTRON LTD·Filed 2018·Granted May 17, 2022·0 cites·14 claims
- 3858US12100591B2Photoactive metal-based hard mask integrationTOKYO ELECTRON LTD·Filed 2022·Granted Sep 24, 2024·0 cites·20 claims
- 3958US11380554B2Gas phase etching system and methodTOKYO ELECTRON LTD·Filed 2020·Granted Jul 5, 2022·0 cites·16 claims
- 4056US12438006B2Metal hard mask integrationTOKYO ELECTRON LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 4156US12322597B2Pitch scaling in microfabricationTOKYO ELECTRON LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 4255US11495436B2Systems and methods to control critical dimension (CD) shrink ratio through radio frequency (RF) pulsingTOKYO ELECTRON LTD·Filed 2021·Granted Nov 8, 2022·0 cites·20 claims
- 4355US11398379B2Platform and method of operating for integrated end-to-end self-aligned multi-patterning processTOKYO ELECTRON LTD·Filed 2019·Granted Jul 26, 2022·0 cites·19 claims
- 4454US11882776B2In-situ encapsulation of metal-insulator-metal (MIM) stacks for resistive random access memory (RERAM) cellsTOKYO ELECTRON LTD·Filed 2021·Granted Jan 23, 2024·0 cites·20 claims
- 4554US2020043764A1Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using sameTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 4654US2020006100A1Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using sameTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 4753US12308250B2Pre-etch treatment for metal etchTOKYO ELECTRON LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 4853US12009211B2Method for highly anisotropic etching of titanium oxide spacer using selective top-depositionTOKYO ELECTRON LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 4952US11658038B2Method for dry etching silicon carbide films for resist underlayer applicationsTOKYO ELECTRON LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 5050US11127594B2Manufacturing methods for mandrel pull from spacers for multi-color patterningTOKYO ELECTRON LTD·Filed 2018·Granted Sep 21, 2021·0 cites·27 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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