Inventor · disambiguated record
Shogo Hirai
Also filed as: HIRAI SHOGO
7 granted patents·6 pending applications·39 citations·filing 2004–2012
82Inventor score
Files withPANASONIC CORP4HIRAI SHOGO2MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2NAKAMURA TADASHI2HIGUCHI TAKAYUKI1
Top patents by PatentIndex Score
13 records- 0188US7956293B2Multilayer printed wiring board and manufacturing method thereofPANASONIC CORP·Filed 2007·Granted Jun 7, 2011·15 cites·7 claims
- 0281US8563872B2Wiring board, wiring board manufacturing method, and via pasteHIRAI SHOGO·Filed 2011·Granted Oct 22, 2013·8 cites·17 claims
- 0378US8134082B2Solid printed circuit board and method of manufacturing the sameNAKAMURA TADASHI·Filed 2008·Granted Mar 13, 2012·9 cites·16 claims
- 0471US8604350B2Multilayer wiring substrate and manufacturing method of multilayer wiring substrateHIMORI TSUYOSHI·Filed 2011·Granted Dec 10, 2013·3 cites·15 claims
- 0557US8658910B2Circuit board and method of manufacturing the circuit boardKUBO TETSURO·Filed 2012·Granted Feb 25, 2014·1 cites·10 claims
- 0651US2011030207A1Multilayer printed wiring board and manufacturing method thereofPANASONIC CORP·Filed 2010·Application pending·0 cites
- 0749US7510759B2Electronic part and manufacturing method thereofPANASONIC CORP·Filed 2004·Granted Mar 31, 2009·3 cites·13 claims
- 0846US2008121416A1Multilayer Printed Wiring Board And Manufacturing Method For SameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 0945US8076589B2Multilayer wiring board and its manufacturing methodNAKAMURA TADASHI·Filed 2006·Granted Dec 13, 2011·0 cites·18 claims
- 1044US2013008698A1Multilayer wiring board, production method of the same, and via pastePANASONIC CORP·Filed 2011·Application pending·0 cites
- 1142US2009229862A1Multilayer printed wiring board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 1239US2013068513A1Wiring board, production method of the same, and via pasteHIRAI SHOGO·Filed 2011·Application pending·0 cites
- 1336US2013062107A1Multilayer wiring board and production method of the sameHIGUCHI TAKAYUKI·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →