Inventor · disambiguated record
Bodin Kasemset
Also filed as: KASEMSET BODIN
4 granted patents·10 citations·filing 2013–2016
67Inventor score
Technology areasH10W
Files withNXP BV4
Top patents by PatentIndex Score
4 records- 0174US9424507B2Dual interface IC card components and method for manufacturing the dual-interface IC card componentsNXP BV·Filed 2014·Granted Aug 23, 2016·5 cites·20 claims
- 0265US8884415B2IC package with stainless steel leadframeNXP BV·Filed 2013·Granted Nov 11, 2014·3 cites·20 claims
- 0363US9595455B1Integrated circuit module with filled contact gapsNXP BV·Filed 2016·Granted Mar 14, 2017·2 cites·20 claims
- 0433US10727168B2Inter-connection of a lead frame with a passive component intermediate structureNXP BV·Filed 2014·Granted Jul 28, 2020·0 cites·20 claims
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