Inventor · disambiguated record
Tiao Zhou
Also filed as: ZHOU TIAO
22 granted patents·5 pending applications·352 citations·filing 2000–2022
95Inventor score
Files withST MICROELECTRONICS INC13MAXIM INTEGRATED PRODUCTS8AMS INT AG1AMS OSRAM ASIA PACIFIC PTE LTD1HUNDT MICHAEL J1
Top patents by PatentIndex Score
27 records- 0195US6900535B2BGA/LGA with built in heat slug/spreaderST MICROELECTRONICS INC·Filed 2002·Granted May 31, 2005·110 cites·20 claims
- 0290US8084871B2Redistribution layer enhancement to improve reliability of wafer level packagingRAHIM S KAYSAR·Filed 2009·Granted Dec 27, 2011·44 cites·18 claims
- 0390US7244967B2Apparatus and method for attaching an integrating circuit sensor to a substrateST MICROELECTRONICS INC·Filed 2004·Granted Jul 17, 2007·52 cites·20 claims
- 0488US10608125B1Exposed die sensor packageMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Mar 31, 2020·7 cites·19 claims
- 0585US9040408B1Techniques for wafer-level processing of QFN packagesMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted May 26, 2015·12 cites·22 claims
- 0684US6998721B2Stacking and encapsulation of multiple interconnected integrated circuitsST MICROELECTRONICS INC·Filed 2002·Granted Feb 14, 2006·33 cites·20 claims
- 0780US9583425B2Solder fatigue arrest for wafer level packageMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Feb 28, 2017·6 cites·8 claims
- 0879US8259464B2Wafer level package (WLP) device having bump assemblies including a barrier metalZHOU TIAO·Filed 2010·Granted Sep 4, 2012·7 cites·20 claims
- 0978US9356003B1Highly integrated flex sensor packageMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted May 31, 2016·4 cites·9 claims
- 1078US7315079B2Thermally-enhanced ball grid array package structure and methodST MICROELECTRONICS INC·Filed 2007·Granted Jan 1, 2008·7 cites·15 claims
- 1176US7294530B2Method for encapsulating multiple integrated circuitsST MICROELECTRONICS INC·Filed 2005·Granted Nov 13, 2007·6 cites·41 claims
- 1274US6686227B2Method and system for exposed die molding for integrated circuit packagingST MICROELECTRONICS INC·Filed 2002·Granted Feb 3, 2004·20 cites·20 claims
- 1371US7304362B2Molded integrated circuit package with exposed active areaST MICROELECTRONICS INC·Filed 2002·Granted Dec 4, 2007·15 cites·20 claims
- 1469US9371982B2Glass based multichip packageMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Jun 21, 2016·2 cites·12 claims
- 1568US7402454B2Molded integrated circuit package with exposed active areaST MICROELECTRONICS INC·Filed 2006·Granted Jul 22, 2008·3 cites·19 claims
- 1663US8163220B2Method of packaging integrated circuitsHUNDT MICHAEL J·Filed 2008·Granted Apr 24, 2012·2 cites·20 claims
- 1763US6817854B2Mold with compensating baseST MICROELECTRONICS INC·Filed 2002·Granted Nov 16, 2004·8 cites·20 claims
- 1862US6815262B2Apparatus and method for attaching an integrated circuit sensor to a substrateST MICROELECTRONICS INC·Filed 2002·Granted Nov 9, 2004·9 cites·20 claims
- 1951US2024105861A1Optical system packagingAMS INT AG·Filed 2021·Application pending·0 cites
- 2050US2025004107A1Sensor package and method of manufacturing a sensor packageAMS OSRAM ASIA PACIFIC PTE LTD·Filed 2022·Application pending·0 cites
- 2148US6586821B1Lead-frame forming for improved thermal performanceST MICROELECTRONICS INC·Filed 2000·Granted Jul 1, 2003·3 cites·6 claims
- 2247US7180175B2Thermally-enhanced ball grid array package structure and methodST MICROELECTRONICS INC·Filed 2002·Granted Feb 20, 2007·2 cites·17 claims
- 2342US9425064B2Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packagesMAXIM INTEGRATED PRODUCTS·Filed 2012·Granted Aug 23, 2016·0 cites·15 claims
- 2442US2005082718A1Mold with compensating baseST MICROELECTRONICS INC·Filed 2004·Application pending·0 cites
- 2542US2014252571A1Wafer-level package mitigated undercutMAXIM INTEGRATED PRODUCTS·Filed 2013·Application pending·0 cites
- 2636US2003151120A1Lead-frame forming for improved thermal performanceFiled 2002·Application pending·0 cites
- 2731US10204876B2Pad defined contact for wafer level packageMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Feb 12, 2019·0 cites·16 claims
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