Inventor · disambiguated record
Fumio Kuraishi
Also filed as: KURAISHI FUMIO
7 granted patents·584 citations·filing 1987–1999
89Inventor score
Technology areasH10W
Files withSHINKO ELECTRIC IND CO7
Top patents by PatentIndex Score
7 records- 0195US5859471ASemiconductor device having tab tape lead frame with reinforced outer leadsSHINKO ELECTRIC IND CO·Filed 1997·Granted Jan 12, 1999·323 cites·15 claims
- 0281US5365107ASemiconductor device having tab tapeSHINKO ELECTRIC IND CO·Filed 1993·Granted Nov 15, 1994·74 cites·12 claims
- 0376US4809053ASemiconductor device and lead frame used thereforSHINKO ELECTRIC IND CO·Filed 1987·Granted Feb 28, 1989·50 cites·6 claims
- 0470US5384204ATape automated bonding in semiconductor techniqueSHINKO ELECTRIC IND CO·Filed 1993·Granted Jan 24, 1995·47 cites·7 claims
- 0569US6074567AMethod for producing a semiconductor packageSHINKO ELECTRIC IND CO·Filed 1998·Granted Jun 13, 2000·41 cites·10 claims
- 0658US6081426ASemiconductor package having a heat slugSHINKO ELECTRIC IND CO·Filed 1999·Granted Jun 27, 2000·25 cites·12 claims
- 0756US5905634ASemiconductor package having a heat slugSHINKO ELECTRIC IND CO·Filed 1997·Granted May 18, 1999·24 cites·8 claims
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