Inventor · disambiguated record
Hsin-Ting Huang
Also filed as: HUANG HSIN-TING
35 granted patents·403 citations·filing 2010–2019
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD18TAIWAN SEMICONDUCTOR MFG9HUANG HSIN-TING2TSAI SHANG-YING2CHUNG TIEN-KAN1
Top patents by PatentIndex Score
35 records- 0199US8377798B2Method and structure for wafer to wafer bonding in semiconductor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·222 cites·23 claims
- 0298US9181083B2MEMS devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 10, 2015·52 cites·20 claims
- 0397US9567204B2Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 14, 2017·18 cites·20 claims
- 0495US10392244B2Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 27, 2019·9 cites·20 claims
- 0595US9656857B2Microelectromechanical systems (MEMS) devices at different pressuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 23, 2017·13 cites·20 claims
- 0692US10131540B2Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 20, 2018·9 cites·20 claims
- 0792US8647962B2Wafer level packaging bondLIU MARTIN·Filed 2010·Granted Feb 11, 2014·14 cites·13 claims
- 0890US8841201B2Systems and methods for post-bonding wafer edge sealTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 23, 2014·12 cites·20 claims
- 0990US8580594B2Method of fabricating a semiconductor device having recessed bonding siteHUANG HSIN-TING·Filed 2011·Granted Nov 12, 2013·13 cites·18 claims
- 1087US9845236B2Monolithic MEMS platform for integrated pressure, temperature, and gas sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 19, 2017·4 cites·20 claims
- 1187US9054121B2MEMS structures and methods for forming the sameLIU PING-YIN·Filed 2011·Granted Jun 9, 2015·5 cites·20 claims
- 1286US10266390B2Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·2 cites·20 claims
- 1386US9630832B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 25, 2017·6 cites·20 claims
- 1485US9202792B2Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)TAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 1, 2015·7 cites·18 claims
- 1585US8928162B2Sensor with energy-harvesting deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 6, 2015·4 cites·20 claims
- 1678US9355896B2Package systemsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 31, 2016·2 cites·20 claims
- 1776US9856139B2Microelectromechanical systems (MEMS) devices at different pressuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 2, 2018·1 cites·20 claims
- 1873US9776858B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 3, 2017·2 cites·20 claims
- 1971US10464808B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 2071US9422151B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·1 cites·20 claims
- 2171US8674495B2Package systems having a eutectic bonding material and manufacturing methods thereofSHU CHIA-PAO·Filed 2011·Granted Mar 18, 2014·2 cites·20 claims
- 2266US9112001B2Package systems and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 18, 2015·1 cites·20 claims
- 2365US8723343B2Sensor with energy-harvesting deviceCHUNG TIEN-KAN·Filed 2011·Granted May 13, 2014·1 cites·20 claims
- 2464US11130670B2MEMS devices with an element having varying widthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 2564US8735260B2Method to prevent metal pad damage in wafer level packageTSAI SHANG-YING·Filed 2010·Granted May 27, 2014·1 cites·20 claims
- 2663US10981781B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 2762US9584003B2Energy-harvesting deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 28, 2017·0 cites·20 claims
- 2862US9246401B2Energy-harvesting device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 26, 2016·0 cites·20 claims
- 2960US9673169B2Method and apparatus for a wafer seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 6, 2017·1 cites·20 claims
- 3057US9533876B2MEMS structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 3, 2017·0 cites·20 claims
- 3155US9034677B2MEMS device and method of formation thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 19, 2015·0 cites·20 claims
- 3253US9714166B2Thin film structure for hermetic sealingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 25, 2017·0 cites·21 claims
- 3348US8853801B2MEMS devices and methods of forming the sameTSAI SHANG-YING·Filed 2012·Granted Oct 7, 2014·0 cites·19 claims
- 3444US10266395B2Semiconductive structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·0 cites·20 claims
- 3543US8686571B2Bonding layer structure and method for wafer to wafer bondingHUANG HSIN-TING·Filed 2012·Granted Apr 1, 2014·0 cites·14 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →