Inventor · disambiguated record
Yoon Su Kim
Also filed as: KIM YOON-SU
19 granted patents·12 pending applications·90 citations·filing 2006–2021
92Inventor score
Top patents by PatentIndex Score
31 records- 0191US9996246B2Device and method for displaying execution result of applicationSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 12, 2018·9 cites·30 claims
- 0291US9639252B2Device and method for displaying execution result of applicationSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 2, 2017·17 cites·21 claims
- 0379USD769918SDisplay screen or portion thereof with graphical user interfaceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 25, 2016·23 cites·1 claims
- 0477US9173291B2Circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 27, 2015·3 cites·31 claims
- 0572US9607157B2Method and device for providing a private pageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 28, 2017·2 cites·38 claims
- 0667US10516741B2Control device and method for controlling function thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 24, 2019·1 cites·20 claims
- 0766USD779519SDisplay screen or portion thereof with graphical user interfaceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 21, 2017·13 cites·1 claims
- 0862USD769277SDisplay screen or portion thereof with graphical user interfaceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 18, 2016·11 cites·1 claims
- 0962US7768116B2Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Aug 3, 2010·2 cites·3 claims
- 1060US8957319B2Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 17, 2015·1 cites·15 claims
- 1158US11798829B2Open-ended type substrate receiving cassette and system thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 1258US9386706B2Line width protector printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 5, 2016·0 cites·7 claims
- 1357US9971911B2Method and device for providing a private pageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 15, 2018·0 cites·16 claims
- 1449US9320142B2Electrode structureSAMSUNG ELECTRO MECH·Filed 2015·Granted Apr 19, 2016·0 cites·6 claims
- 1549US2015101848A1Surface-treated copper foil and copper-clad laminate plate including the same, printed curcuit board using the same, and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1649US2018233433A1Fan-out semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 1748US2014166347A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1848US2015040031A1Method and electronic device for sharing image cardSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1946US2017154838A1Fan-out semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 2045US11380636B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 5, 2022·0 cites·19 claims
- 2143USD771665SDisplay screen or portion thereof with graphical user interfaceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 15, 2016·4 cites·1 claims
- 2243USD770496SDisplay screen or portion thereof with graphical user interfaceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 1, 2016·4 cites·1 claims
- 2342US8236690B2Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball padYOON KYOUNG RO·Filed 2010·Granted Aug 7, 2012·0 cites·3 claims
- 2442US2014123182A1Video content playing schemeKT CORP·Filed 2013·Application pending·0 cites
- 2540US9002580B2System and method for controlling electrically-powered steering apparatus of vehicleKIM NAM YOUNG·Filed 2012·Granted Apr 7, 2015·0 cites·9 claims
- 2640US2014186651A1Printed circuit board having copper plated layer with roughness and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2737US2022105802A1Electronic device and vehicle including sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 2837US2015193613A1Portable apparatus and method of connecting to external apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 2936US2012161323A1Substrate for package and method for manufacturing the sameKIM YOON SU·Filed 2011·Application pending·0 cites
- 3036US2016124582A1Terminal apparatus and method for controlling the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 3132US2015331551A1Image display apparatus, image display method, and computer-readable recording mediumSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →