Inventor · disambiguated record
Young Do Kweon
Also filed as: KWEON YOUNG DO
81 granted patents·72 pending applications·1,100 citations·filing 1995–2024
99Inventor score
Files withSAMSUNG ELECTRO MECH85PARK SEUNG WOOK11AMKOR TECH SINGAPORE HOLDING PTE LTD9CHIPPAC INC6SAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
153 records- 0199US7749882B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 6, 2010·126 cites·16 claims
- 0297US7910385B2Method of fabricating microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 22, 2011·54 cites·17 claims
- 0395US5900676ASemiconductor device package structure having column leads and a method for production thereofSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted May 4, 1999·264 cites·13 claims
- 0494US8017437B2Method for manufacturing a semiconductor packageSAMSUNG ELECTRO & MDASH MECHANICS CO LTD·Filed 2009·Granted Sep 13, 2011·45 cites·8 claims
- 0592US8830689B2Interposer-embedded printed circuit boardKIM JIN GU·Filed 2011·Granted Sep 9, 2014·19 cites·7 claims
- 0692US7663250B2Wafer level package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 16, 2010·26 cites·12 claims
- 0792US5656856AReduced noise semiconductor package stackSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Aug 12, 1997·147 cites·16 claims
- 0891US6940178B2Self-coplanarity bumping shape for flip chipCHIPPAC INC·Filed 2002·Granted Sep 6, 2005·51 cites·13 claims
- 0989US9264010B2Via structure having open stub and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 16, 2016·9 cites·12 claims
- 1089US7642656B2Semiconductor package and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Jan 5, 2010·15 cites·7 claims
- 1188US9345142B2Chip embedded board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted May 17, 2016·8 cites·7 claims
- 1288US8093705B2Dual face package having resin insulating layerPARK SEUNG WOOK·Filed 2009·Granted Jan 10, 2012·14 cites·8 claims
- 1387US8273660B2Method of manufacturing a dual face packagePARK SEUNG WOOK·Filed 2011·Granted Sep 25, 2012·8 cites·13 claims
- 1486US10672715B2Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 2, 2020·6 cites·18 claims
- 1584US6737295B2Chip scale package with flip chip interconnectCHIPPAC INC·Filed 2002·Granted May 18, 2004·34 cites·14 claims
- 1683US8704350B2Stacked wafer level package and method of manufacturing the samePARK SEUNG WOOK·Filed 2009·Granted Apr 22, 2014·11 cites·5 claims
- 1783US8658467B2Method of manufacturing stacked wafer level packagePARK SEUNG WOOK·Filed 2011·Granted Feb 25, 2014·7 cites·8 claims
- 1881US9236178B2Coil component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Granted Jan 12, 2016·4 cites·8 claims
- 1981US9183979B2Chip inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Granted Nov 10, 2015·4 cites·12 claims
- 2080US8922002B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesKWEON YOUNG DO·Filed 2010·Granted Dec 30, 2014·4 cites·11 claims
- 2180US8064215B2Semiconductor chip package and printed circuit boardCHUNG YUL-KYO·Filed 2008·Granted Nov 22, 2011·11 cites·4 claims
- 2280US7875497B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 25, 2011·6 cites·4 claims
- 2380US7875983B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 25, 2011·6 cites·5 claims
- 2480US2024387230A1Carrier Assisted Substrate Method of Manufacturing an Electronic Device and Electronic Device Produced TherebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2579US8994478B1Common mode filterSAMSUNG ELECTRO MECH·Filed 2014·Granted Mar 31, 2015·4 cites·9 claims
- 2679US7407877B2Self-coplanarity bumping shape for flip-chipCHIPPAC INC·Filed 2005·Granted Aug 5, 2008·7 cites·20 claims
- 2779US2025105165A1Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2878US9520223B2Inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Dec 13, 2016·3 cites·9 claims
- 2978US8981889B2Common mode filter with ESD protection pattern built thereinSAMSUNG ELECTRO MECH·Filed 2013·Granted Mar 17, 2015·3 cites·8 claims
- 3078US8143099B2Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layerPARK SEUNG WOOK·Filed 2009·Granted Mar 27, 2012·8 cites·12 claims
- 3177US11410935B2Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 9, 2022·1 cites·20 claims
- 3277US9173291B2Circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 27, 2015·3 cites·31 claims
- 3377US9153957B2Electrostatic discharge protection device and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 6, 2015·1 cites·12 claims
- 3477US7632709B2Method of manufacturing wafer level packageSAMSUNG ELECTRO MECH·Filed 2008·Granted Dec 15, 2009·7 cites·6 claims
- 3576US5834832APacking structure of semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Nov 10, 1998·52 cites·15 claims
- 3674US8159071B2Semiconductor package with a metal postKIM WOON-CHUN·Filed 2009·Granted Apr 17, 2012·5 cites·1 claims
- 3774US7947530B2Method of manufacturing wafer level package including coating and removing resin over the dicing linesSAMSUNG ELECTRO MECH·Filed 2009·Granted May 24, 2011·5 cites·6 claims
- 3873US9741490B2Power inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 22, 2017·2 cites·8 claims
- 3973US8026590B2Die package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Sep 27, 2011·5 cites·16 claims
- 4073US7727877B2Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillarSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 1, 2010·6 cites·5 claims
- 4172US9786428B2Common mode filter and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Oct 10, 2017·2 cites·4 claims
- 4272US9312587B2Common mode filter and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 12, 2016·3 cites·13 claims
- 4371US12165986B2Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 4471US12051611B2Carrier assisted substrate method of manufacturing an electronic device and electronic device produced therebyAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 30, 2024·0 cites·14 claims
- 4571US8283768B2Wafer Level package for heat dissipation and method of manufacturing the sameKANG JOON SEOK·Filed 2009·Granted Oct 9, 2012·4 cites·6 claims
- 4670US10083931B2Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the sameMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 25, 2018·1 cites·9 claims
- 4770US8582314B2Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structurePARK SEUNG WOOK·Filed 2010·Granted Nov 12, 2013·3 cites·5 claims
- 4870US8110914B2Wafer level package with removable chip protecting layerKANG JOON SEOK·Filed 2009·Granted Feb 7, 2012·4 cites·4 claims
- 4969US9240385B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted Jan 19, 2016·1 cites·17 claims
- 5069US9196506B2Method for manufacturing interposerSAMSUNG ELECTRO MECH·Filed 2012·Granted Nov 24, 2015·2 cites·8 claims
Showing the top 50 of 153 patent records by PatentIndex Score.
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