Inventor · disambiguated record
Chiung-Han Yeh
Also filed as: YEH CHIUN-HAN · YEH CHIUNG-HAN
42 granted patents·1 pending application·3,060 citations·filing 2008–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD19TAIWAN SEMICONDUCTOR MFG10YEH CHIUNG-HAN3CHUANG HARRY2CHUANG HARRY HAK-LAY2
Top patents by PatentIndex Score
43 records- 0199US9263511B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·1k cites·20 claims
- 0299US9048222B2Method of fabricating interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·1.1k cites·20 claims
- 0399US8680647B2Packages with passive devices and methods of forming the sameYU CHEN-HUA·Filed 2012·Granted Mar 25, 2014·594 cites·20 claims
- 0498US11581250B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·4 cites·20 claims
- 0598US9460987B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·22 cites·20 claims
- 0698US8105891B2Method for tuning a work function of high-K metal gate devicesYEH CHIUNG-HAN·Filed 2010·Granted Jan 31, 2012·124 cites·20 claims
- 0797US9922903B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·12 cites·20 claims
- 0895US8093120B2Integrating a first contact structure in a gate last processYEH CHIUNG-HAN·Filed 2010·Granted Jan 10, 2012·21 cites·20 claims
- 0995US8039381B2Photoresist etch back method for gate last processTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Oct 18, 2011·33 cites·14 claims
- 1095US8035165B2Integrating a first contact structure in a gate last processTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 11, 2011·25 cites·20 claims
- 1194US10269685B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
- 1293US9960106B2Package with metal-insulator-metal capacitor and method of manufacturing the sameChen shuo mao·Filed 2012·Granted May 1, 2018·13 cites·20 claims
- 1392US11037861B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·4 cites·20 claims
- 1492US9040381B2Packages with passive devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·11 cites·20 claims
- 1592US8890260B2Polysilicon design for replacement gate technologyCHUANG HARRY HAK-LAY·Filed 2009·Granted Nov 18, 2014·14 cites·21 claims
- 1690US8735235B2Integrated circuit metal gate structure and method of fabricationCHUANG HARRY·Filed 2008·Granted May 27, 2014·15 cites·15 claims
- 1789US10515875B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 24, 2019·3 cites·20 claims
- 1889US2025311354A1Polysilicon Design for Replacement Gate TechnologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1988US8125051B2Device layout for gate last processCHUANG HARRY·Filed 2009·Granted Feb 28, 2012·16 cites·20 claims
- 2084US10971441B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·2 cites·20 claims
- 2184US8530326B2Method of fabricating a dummy gate structure in a gate last processLAI SU-CHEN·Filed 2012·Granted Sep 10, 2013·6 cites·17 claims
- 2284US8237227B2Dummy gate structure for gate last processLAI SU-CHEN·Filed 2009·Granted Aug 7, 2012·10 cites·14 claims
- 2384US8048752B2Spacer shape engineering for void-free gap-filling processTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 1, 2011·9 cites·18 claims
- 2481US10658492B2Polysilicon design for replacement gate technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 19, 2020·1 cites·20 claims
- 2581US8932951B2Dishing-free gap-filling with multiple CMPsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 13, 2015·4 cites·15 claims
- 2681US7927943B2Method for tuning a work function of high-k metal gate devicesTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Apr 19, 2011·7 cites·20 claims
- 2779US10403736B2Polysilicon design for replacement gate technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 3, 2019·1 cites·20 claims
- 2879US10084061B2Polysilicon design for replacement gate technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 25, 2018·1 cites·20 claims
- 2978US9929251B2Polysilicon design for replacement gate technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 27, 2018·1 cites·20 claims
- 3077US12426333B2Polysilicon design for replacement gate technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 3177US8394692B2Integrating a first contact structure in a gate last processYEH CHIUNG-HAN·Filed 2011·Granted Mar 12, 2013·3 cites·9 claims
- 3276US10153205B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 11, 2018·2 cites·20 claims
- 3375US8476126B2Gate stack for high-K/metal gate last processCHUANG HARRY HAK-LAY·Filed 2010·Granted Jul 2, 2013·4 cites·20 claims
- 3474US11018241B2Polysilicon design for replacement gate technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 25, 2021·0 cites·20 claims
- 3573US9263396B2Photo alignment mark for a gate last processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·2 cites·20 claims
- 3672US9679988B2Polysilicon design for replacement gate technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 13, 2017·1 cites·20 claims
- 3771US8598630B2Photo alignment mark for a gate last processSHEN GARY·Filed 2009·Granted Dec 3, 2013·4 cites·20 claims
- 3863US10475731B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 12, 2019·0 cites·20 claims
- 3963US9455344B2Integrated circuit metal gate structure having tapered profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 27, 2016·1 cites·20 claims
- 4060US10276484B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·0 cites·20 claims
- 4155US8669153B2Integrating a first contact structure in a gate last processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 11, 2014·0 cites·11 claims
- 4250US8552522B2Dishing-free gap-filling with multiple CMPsWU MING-YUAN·Filed 2011·Granted Oct 8, 2013·0 cites·6 claims
- 4348US8461654B2Spacer shape engineering for void-free gap-filling processWU MING-YUAN·Filed 2011·Granted Jun 11, 2013·0 cites·15 claims
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