Inventor · disambiguated record
Bing Wu
Also filed as: WU BING · WU BING-CHANG
33 granted patents·14 pending applications·367 citations·filing 1996–2023
97Inventor score
Files withUNITED MICROELECTRONICS CORP16NAT STARCH CHEM INVEST7HANGZHOU SILICON MAGIC SEMICONDUCTOR TECH CO LTD6WU BING-CHANG5NANJING UNIVERSITY OF TECHNOLOGY1
Top patents by PatentIndex Score
47 records- 0191US11424344B2Trench MOSFET and method for manufacturing the sameHANGZHOU SILICON MAGIC SEMICONDUCTOR TECH CO LTD·Filed 2020·Granted Aug 23, 2022·3 cites·19 claims
- 0291US6900541B1Semiconductor chip capable of implementing wire bonding over active circuitsUNITED MICROELECTRONICS CORP·Filed 2004·Granted May 31, 2005·68 cites·16 claims
- 0388US7372168B2Semiconductor chip capable of implementing wire bonding over active circuitsUNITED MICROELECTRONICS CORP·Filed 2006·Granted May 13, 2008·15 cites·29 claims
- 0488US7326754B2Thermoset adhesive filmsNIKOLIC NIKOLA A·Filed 2005·Granted Feb 5, 2008·14 cites·3 claims
- 0588US5685758AHot melt adhesive compositions with improved wicking propertiesNAT STARCH CHEM INVEST·Filed 1996·Granted Nov 11, 1997·69 cites·5 claims
- 0686US7304385B2Semiconductor chip capable of implementing wire bonding over active circuitsUNITED MICROELECTRONICS CORP·Filed 2006·Granted Dec 4, 2007·12 cites·3 claims
- 0782US7208837B2Semiconductor chip capable of implementing wire bonding over active circuitsUNITED MICROELECTRONICS CORP·Filed 2005·Granted Apr 24, 2007·9 cites·11 claims
- 0879US7071575B2Semiconductor chip capable of implementing wire bonding over active circuitsUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jul 4, 2006·22 cites·27 claims
- 0971US5807959AFlexible epoxy adhesives with low bleeding tendencyNAT STARCH CHEM INVEST·Filed 1997·Granted Sep 15, 1998·41 cites·4 claims
- 1066US5770706ASnap-cure epoxy adhesivesNAT STARCH CHEM INVEST·Filed 1996·Granted Jun 23, 1998·28 cites·24 claims
- 1164US6482739B2Method for decreasing the resistivity of the gate and the leaky junction of the source/drainUNITED MICROELECTRONICS CORP·Filed 2001·Granted Nov 19, 2002·11 cites·26 claims
- 1263US11757035B2LDMOS transistor and method for manufacturing the sameHANGZHOU SILICON MAGIC SEMICONDUCTOR TECH CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·12 claims
- 1359US7056796B2Method for fabricating silicide by heating an epitaxial layer and a metal layer formed thereonUNITED MICROELECTRONICS CORP·Filed 2003·Granted Jun 6, 2006·8 cites·17 claims
- 1458US8735282B2Semiconductor device and manufacturing method thereforWU BING·Filed 2011·Granted May 27, 2014·1 cites·20 claims
- 1557US6277729B1Method of manufacturing transistor barrier layerUNITED MICROELECTRONICS CORP·Filed 1998·Granted Aug 21, 2001·22 cites·13 claims
- 1654US7274108B2Semiconductor chip capable of implementing wire bonding over active circuitsUNITED MICROELECTRONICS CORP·Filed 2004·Granted Sep 25, 2007·5 cites·19 claims
- 1753US2005137340A1Thermoset adhesive filmsFiled 2005·Application pending·0 cites
- 1851US12464765B2LDMOS device and method for fabricating the sameSILICON MAGIC SEMICONDUCTOR TECH HANGZHOU CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·9 claims
- 1951US11355631B2LDMOS transistor and method for manufacturing the sameHANGZHOU SILICON MAGIC SEMICONDUCTOR TECH CO LTD·Filed 2019·Granted Jun 7, 2022·0 cites·7 claims
- 2050US11670502B2SiC MOSFET and method for manufacturing the sameHANGZHOU SILICON MAGIC SEMICONDUCTOR TECH CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 2150US7212396B2Method for fabricating a thin film resistorUNITED MICROELECTRONICS CORP·Filed 2002·Granted May 1, 2007·4 cites·7 claims
- 2249US12176432B2Trench-type MOSFET and method for manufacturing the sameHANGZHOU SILICON MAGIC SEMICONDUCTOR TECH CO LTD·Filed 2021·Granted Dec 24, 2024·0 cites·20 claims
- 2348US12279442B2LDMOS transistor and manufacturing method thereofHANGZHOU SILICON MAGIC SEMICONDUCTOR TECH CO LTD·Filed 2021·Granted Apr 15, 2025·0 cites·13 claims
- 2448US2006030082A1Semiconductor device and fabricating method thereofWU BING-CHANG·Filed 2005·Application pending·0 cites
- 2548US2006030083A1Semiconductor device and fabricating method thereofWU BING-CHANG·Filed 2005·Application pending·0 cites
- 2647US2003232926A1Thermoset adhesive filmsFiled 2002·Application pending·0 cites
- 2745US2018298520A1Self-limited organic molecular beam epitaxy for precisely growing ultrathin C8-BTBT, PTCDA and their heterojunctions on surfaceNANJING UNIVERSITY OF TECHNOLOGY·Filed 2017·Application pending·0 cites
- 2844US6300189B1Method for forming a metal capacitorUNITED MICROELECTRONICS CORP·Filed 2000·Granted Oct 9, 2001·1 cites·13 claims
- 2944US2022037522A1Trench mosfet and method for manufacturing the sameSILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD·Filed 2021·Application pending·0 cites
- 3043US7250670B2Semiconductor structure and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jul 31, 2007·0 cites·19 claims
- 3142US12338909B2Electronic control actuator, exhaust gas treatment system, and vehicle comprising exhaust gas treatment systemNINGBO COLET ELECTRICAL APPLIANCES CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·8 claims
- 3242US2005250256A1Semiconductor device and fabricating method thereofWU BING-CHANG·Filed 2004·Application pending·0 cites
- 3341US2006258121A1Method of blowing the fuse structureWU BING-CHANG·Filed 2005·Application pending·0 cites
- 3440US9570589B2FINFET semiconductor device and fabrication methodSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2015·Granted Feb 14, 2017·0 cites·20 claims
- 3540US6235566B1Two-step silicidation process for fabricating a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 22, 2001·6 cites·9 claims
- 3639US5856383ASnap-cure epoxy adhesivesNAT STARCH CHEM INVEST·Filed 1998·Granted Jan 5, 1999·7 cites·9 claims
- 3738US7057264B2Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanatesNAT STARCH CHEM INVEST·Filed 2002·Granted Jun 6, 2006·2 cites·8 claims
- 3838US2006157819A1Efuse structureWU BING-CHANG·Filed 2005·Application pending·0 cites
- 3938US2023313902A1Electronic control actuator, exhaust-gas treatment system and vehicle comprising the sameNINGBO COLET ELETRICAL APPLIANCES CO LTD·Filed 2023·Application pending·0 cites
- 4037US6010958AMethod for improving the planarization of dielectric layer in the fabrication of metallic interconnectsUNITED MICROELECTRONICS CORP·Filed 1997·Granted Jan 4, 2000·6 cites·13 claims
- 4137US2003176055A1Method and structure for reducing capacitance between interconnect linesUNITED MICROELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 4236US2013015443A1Semiconductor device and manufacturing method thereofSEMICONDUCTOR MFG INT BEIJING·Filed 2011·Application pending·0 cites
- 4335US6184118B1Method for preventing the peeling of the tungsten metal after the metal-etching processUNITED MICROELECTRONICS CORP·Filed 1998·Granted Feb 6, 2001·5 cites·6 claims
- 4433US2002115289A1Method for decreasing the resistivity of the gate and the leaky junction of the source/drainFiled 2001·Application pending·0 cites
- 4533US2002123222A1Method of fabricating a salicide layerFiled 2001·Application pending·0 cites
- 4631US5854315ASnap-cure epoxy adhesivesNAT STARCH CHEM INVEST·Filed 1997·Granted Dec 29, 1998·2 cites·7 claims
- 4728US6022616AAdhesive composition with small particle size for microelectronic devicesNAT STARCH CHEM INVEST·Filed 1998·Granted Feb 8, 2000·6 cites·7 claims
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