Inventor · disambiguated record
Tzong-Da Ho
Also filed as: HO TZONG DA
28 granted patents·3 pending applications·1,343 citations·filing 2000–2004
98Inventor score
Top patents by PatentIndex Score
31 records- 0197US6507104B2Semiconductor package with embedded heat-dissipating deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jan 14, 2003·147 cites·11 claims
- 0297US6444498B1Method of making semiconductor package with heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Sep 3, 2002·146 cites·19 claims
- 0397US6369455B1Externally-embedded heat-dissipating device for ball grid array integrated circuit packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Apr 9, 2002·149 cites·14 claims
- 0497US6282094B1Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 28, 2001·182 cites·23 claims
- 0595US6359341B1Ball grid array integrated circuit package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Mar 19, 2002·114 cites·20 claims
- 0694US6443351B1Method of achieving solder ball coplanarity on ball grid array integrated circuit packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Sep 3, 2002·96 cites·10 claims
- 0792US6657296B2Semicondctor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Dec 2, 2003·72 cites·11 claims
- 0891US6458626B1Fabricating method for semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 1, 2002·64 cites·22 claims
- 0988US6611434B1Stacked multi-chip package structure with on-chip integration of passive componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 26, 2003·52 cites·8 claims
- 1085US6699731B2Substrate of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Mar 2, 2004·32 cites·20 claims
- 1183US6650006B2Semiconductor package with stacked chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Nov 18, 2003·35 cites·20 claims
- 1283US6469897B2Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 22, 2002·35 cites·12 claims
- 1381US6319750B1Layout method for thin and fine ball grid array package substrate with plating busSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Nov 20, 2001·27 cites·2 claims
- 1480US6844622B2Semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jan 18, 2005·26 cites·12 claims
- 1580US6451625B1Method of fabricating a flip-chip ball-grid-array package with molded underfillSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Sep 17, 2002·30 cites·9 claims
- 1677US6306682B1Method of fabricating a ball grid array integrated circuit package having an encapsulating bodySILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Oct 23, 2001·26 cites·14 claims
- 1773US6867487B2Flash-preventing semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Mar 15, 2005·19 cites·5 claims
- 1872US7074645B2Fabrication method of semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Jul 11, 2006·15 cites·8 claims
- 1963US6703691B2Quad flat non-leaded semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Mar 9, 2004·11 cites·12 claims
- 2063US6479894B2Layout method for thin and fine ball grid array package substrate with plating busSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Nov 12, 2002·9 cites·1 claims
- 2163US6449169B1Ball grid array package with interdigitated power ring and ground ringSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Sep 10, 2002·12 cites·10 claims
- 2262US6707167B2Semiconductor package with crack-preventing memberSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Mar 16, 2004·10 cites·15 claims
- 2361USRE39957EMethod of making semiconductor package with heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Dec 25, 2007·8 cites·29 claims
- 2458US6440779B1Semiconductor package based on window pad type of leadframe and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 27, 2002·14 cites·16 claims
- 2553US6541870B1Semiconductor package with stacked chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Apr 1, 2003·5 cites·17 claims
- 2647US6380059B1Method of breaking electrically conductive traces on substrate into open-circuited stateFiled 2000·Granted Apr 30, 2002·6 cites·8 claims
- 2741US2004106291A1Thermally enhanced wafer-level chip scale package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Application pending·0 cites
- 2839US7148561B2Ball grid array substrate strip with warpage-preventive linkage structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Dec 12, 2006·1 cites·16 claims
- 2939US6483039B2Substrate of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Nov 19, 2002·0 cites·14 claims
- 3039US2002173077A1Thermally enhanced wafer-level chip scale package and method of fabricating the sameFiled 2001·Application pending·0 cites
- 3136US2002079570A1Semiconductor package with heat dissipating elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Application pending·0 cites
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