Inventor · disambiguated record
Shinichi Nishiura
Also filed as: NISHIURA SHINICHI
21 granted patents·6 pending applications·309 citations·filing 1997–2017
96Inventor score
Top patents by PatentIndex Score
27 records- 0175US6112974AWire bonding methodSHINKAWA KK·Filed 1999·Granted Sep 5, 2000·48 cites·3 claims
- 0272US7644852B2Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatusSHINKAWA KK·Filed 2007·Granted Jan 12, 2010·7 cites·4 claims
- 0371US5989995ASemiconductor device and wire bonding method thereforSHINKAWA KK·Filed 1997·Granted Nov 23, 1999·40 cites·4 claims
- 0470US7658313B2Ball forming device in a bonding apparatus and ball forming methodSHINKAWA KK·Filed 2007·Granted Feb 9, 2010·5 cites·6 claims
- 0569US5961029AWire bonding methodSHINKAWA KK·Filed 1998·Granted Oct 5, 1999·37 cites·2 claims
- 0667US6270000B1Wire bonding methodSHINKAWA KK·Filed 2000·Granted Aug 7, 2001·15 cites·3 claims
- 0765US6213384B1Wire bonding methodSHINKAWA KK·Filed 2000·Granted Apr 10, 2001·11 cites·1 claims
- 0863US6784394B2Ball formation method and ball forming device used in a wire bonding apparatusSHINKAWA KK·Filed 2002·Granted Aug 31, 2004·11 cites·3 claims
- 0963US6222274B1Bonding wire loop shape for a semiconductor deviceSHINKAWA KK·Filed 1998·Granted Apr 24, 2001·24 cites·2 claims
- 1062US5967401AWire bonding methodSHINKAWA KK·Filed 1997·Granted Oct 19, 1999·26 cites·3 claims
- 1155US2007182026A1Semiconductor deviceSHINKAWA KK·Filed 2007·Application pending·0 cites
- 1254US6422448B2Ultrasonic horn for a bonding apparatusSHINKAWA KK·Filed 2001·Granted Jul 23, 2002·6 cites·4 claims
- 1354US6182885B1Wire bonding methodSHINKAWA KK·Filed 1999·Granted Feb 6, 2001·19 cites·3 claims
- 1452US6874673B2Initial ball forming method for wire bonding wire and wire bonding apparatusSHINKAWA KK·Filed 2003·Granted Apr 5, 2005·5 cites·8 claims
- 1550US6315190B1Wire bonding methodSHINKAWA KK·Filed 1999·Granted Nov 13, 2001·16 cites·1 claims
- 1648US7299966B2Initial ball forming method for wire bonding wire and wire bonding apparatusSHINKAWA KK·Filed 2003·Granted Nov 27, 2007·3 cites·10 claims
- 1748US6305594B1Wire bonding method and apparatusSHINKAWA KK·Filed 2000·Granted Oct 23, 2001·3 cites·2 claims
- 1847US6845897B2Ultrasonic horn for a bonding apparatusSHINKAWA KK·Filed 2002·Granted Jan 25, 2005·2 cites·4 claims
- 1946US2010078464A1Wire bonding apparatus and ball forming methodSHINKAWA KK·Filed 2008·Application pending·0 cites
- 2045US6758383B2Transducer for a bonding apparatusSHINKAWA KK·Filed 2002·Granted Jul 6, 2004·5 cites·7 claims
- 2145US6343733B1Wire bonding methodSHINKAWA KK·Filed 1999·Granted Feb 5, 2002·12 cites·2 claims
- 2241US2020395818A1The electric power generation system and Potential energy storage device for a power generation systemNISHIKAZE GIKEN KK·Filed 2017·Application pending·0 cites
- 2340US6250539B1Wire bonding methodSHINKAWA KK·Filed 1999·Granted Jun 26, 2001·8 cites·4 claims
- 2439US2017201155A1Electric power generation system and reciprocating mechanism for electric power generation systemNISHIKAZE GIKEN KK·Filed 2015·Application pending·0 cites
- 2538US2003217460A1Semiconductor manufacturing apparatusSHINKAWA KK·Filed 2003·Application pending·0 cites
- 2637US6164518AWire bonding method and apparatusSHINKAWA KK·Filed 1998·Granted Dec 26, 2000·6 cites·4 claims
- 2736US2001054759A1Semiconductor deviceSHINKAWA KK·Filed 2001·Application pending·0 cites
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