Inventor · disambiguated record
Chung-Yu Lu
Also filed as: LU CHUNG-YU
18 granted patents·6 pending applications·40 citations·filing 2010–2025
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD19TAIWAN SEMICONDUCTOR MFG3UNIV NAT CHENG KUNG1UNIV NAT CHIAO TUNG1
Top patents by PatentIndex Score
24 records- 0196US8896094B2Methods and apparatus for inductors and transformers in packagesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 25, 2014·28 cites·17 claims
- 0291US11728278B2Board substrates, three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 15, 2023·6 cites·20 claims
- 0381US9064705B2Methods and apparatus of packaging with interposersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jun 23, 2015·4 cites·20 claims
- 0480US12374599B2Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 0580US2025309043A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0679US2024371782A1Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0778US12113027B2Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 0878US11901306B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 0978US9305808B2Methods and apparatus of packaging with interposersTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 5, 2016·2 cites·20 claims
- 1078US2025343192A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1173US2025149486A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1271US11810793B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 1371US11502043B2Semiconductor structure and method for fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 1468US11915994B2Package structure comprising a semiconductor die with a thermoelectric structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·15 claims
- 1564US10978404B2Semiconductor structure and method for fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 1662US11495472B2Semicondutor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 1761US2025210461A1Packages with double-side metal pillars and the methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1856US9653531B2Methods of manufacturing a packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·0 cites·20 claims
- 1954US9627223B2Methods and apparatus of packaging with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·0 cites·20 claims
- 2052US10262939B2Configurable routing for packaging applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 16, 2019·0 cites·20 claims
- 2152US9530730B2Configurable routing for packaging applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 27, 2016·0 cites·16 claims
- 2248US9882240B2Graft copolymer, process for producing the graft copolymer, process for preparing a gel polymer electrolyte including the graft copolymer, and intermediate copolymer of the graft copolymerUNIV NAT CHENG KUNG·Filed 2014·Granted Jan 30, 2018·0 cites·8 claims
- 2344US9978637B2Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 22, 2018·0 cites·20 claims
- 2434US2011057196A1GaN HEMT with Nitrogen-Rich Tungsten Nitride Schottky Gate and Method of Forming the SameUNIV NAT CHIAO TUNG·Filed 2010·Application pending·0 cites
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