Inventor · disambiguated record
Francesco Preda
Also filed as: PREDA FRANCESCO
11 granted patents·2 pending applications·24 citations·filing 2002–2022
84Inventor score
Top patents by PatentIndex Score
13 records- 0185US7863724B2Circuit substrate having post-fed die side power supply connectionsIBM·Filed 2008·Granted Jan 4, 2011·11 cites·14 claims
- 0268US11388821B2Thin film capacitors for core and adjacent build up layersIBM·Filed 2020·Granted Jul 12, 2022·0 cites·13 claims
- 0368US8586476B2Fabrication method for circuit substrate having post-fed die side power supply connectionsDOURIET DANIEL·Filed 2010·Granted Nov 19, 2013·2 cites·11 claims
- 0464US7015574B2Electronic device carrier adapted for transmitting high frequency signalsIBM·Filed 2002·Granted Mar 21, 2006·11 cites·19 claims
- 0562US10956649B2Semiconductor package metal shadowing checksIBM·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 0662US10660209B2Thin film capacitors for core and adjacent build up layersIBM·Filed 2017·Granted May 19, 2020·0 cites·8 claims
- 0757US12266598B2Dense via pitch interconnect to increase wiring densityIBM·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 0857US10423752B2Semiconductor package metal shadowing checksIBM·Filed 2017·Granted Sep 24, 2019·0 cites·20 claims
- 0953US8722536B2Fabrication method for circuit substrate having post-fed die side power supply connectionsIBM·Filed 2013·Granted May 13, 2014·0 cites·14 claims
- 1052US8158461B2Continuously referencing signals over multiple layers in laminate packagesPREDA FRANCESCO·Filed 2009·Granted Apr 17, 2012·0 cites·13 claims
- 1151US8716851B2Continuously referencing signals over multiple layers in laminate packagesPREDA FRANCESCO·Filed 2012·Granted May 6, 2014·0 cites·20 claims
- 1246US2008093726A1Continuously Referencing Signals over Multiple Layers in Laminate PackagesPREDA FRANCESCO·Filed 2006·Application pending·0 cites
- 1339US2020075468A1Dedicated Integrated Circuit Chip Carrier Plane Connected to Decoupling Capacitor(s)IBM·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →