Inventor · disambiguated record
Charles L. Reynolds
Also filed as: REYNOLDS CHARLES L · REYNOLDS JR CHARLES L · REYNOLDS JR CHARLES LEVERN
23 granted patents·134 citations·filing 1996–2021
93Inventor score
Top patents by PatentIndex Score
23 records- 0189US5796169AStructurally reinforced ball grid array semiconductor package and systemsIBM·Filed 1996·Granted Aug 18, 1998·112 cites·23 claims
- 0283US9263378B1Ball grid array and land grid array assemblies fabricated using temporary resistIBM·Filed 2014·Granted Feb 16, 2016·4 cites·16 claims
- 0381US10249559B2Ball grid array and land grid array assemblies fabricated using temporary resistIBM·Filed 2016·Granted Apr 2, 2019·2 cites·2 claims
- 0478US10622299B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2019·Granted Apr 14, 2020·1 cites·20 claims
- 0575US10756031B1Decoupling capacitor stiffenerIBM·Filed 2019·Granted Aug 25, 2020·2 cites·18 claims
- 0673US7808099B2Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related methodIBM·Filed 2008·Granted Oct 5, 2010·3 cites·3 claims
- 0771US8680670B2Multi-chip module system with removable socketed modulesCASEY JON ALFRED·Filed 2010·Granted Mar 25, 2014·4 cites·16 claims
- 0868US11388821B2Thin film capacitors for core and adjacent build up layersIBM·Filed 2020·Granted Jul 12, 2022·0 cites·13 claims
- 0965US10679931B2Ball grid array and land grid array assemblies fabricated using temporary resistIBM·Filed 2019·Granted Jun 9, 2020·0 cites·20 claims
- 1062US10660209B2Thin film capacitors for core and adjacent build up layersIBM·Filed 2017·Granted May 19, 2020·0 cites·8 claims
- 1161US12504747B2Multicomponent module design and fabricationIBM·Filed 2021·Granted Dec 23, 2025·0 cites·19 claims
- 1261US10224274B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2017·Granted Mar 5, 2019·0 cites·16 claims
- 1360US10224273B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2017·Granted Mar 5, 2019·0 cites·10 claims
- 1460US7932342B2Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend systemIBM·Filed 2008·Granted Apr 26, 2011·0 cites·1 claims
- 1559US10892249B2Carrier and integrated memoryIBM·Filed 2019·Granted Jan 12, 2021·0 cites·20 claims
- 1658US9899313B2Multi terminal capacitor within input output path of semiconductor package interconnectIBM·Filed 2016·Granted Feb 20, 2018·0 cites·19 claims
- 1757US10840214B2Carrier and integrated memoryIBM·Filed 2019·Granted Nov 17, 2020·0 cites·5 claims
- 1854US10515929B2Carrier and integrated memoryIBM·Filed 2018·Granted Dec 24, 2019·0 cites·20 claims
- 1953US10813215B2Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performanceIBM·Filed 2016·Granted Oct 20, 2020·0 cites·16 claims
- 2053US10687420B2Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performanceIBM·Filed 2016·Granted Jun 16, 2020·0 cites·11 claims
- 2153US10431563B1Carrier and integrated memoryIBM·Filed 2018·Granted Oct 1, 2019·0 cites·20 claims
- 2251US10806030B2Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performanceIBM·Filed 2015·Granted Oct 13, 2020·0 cites·13 claims
- 2334US6016947ANon-destructive low melt test for off-composition solderIBM·Filed 1997·Granted Jan 25, 2000·6 cites·20 claims
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