Inventor · disambiguated record
Mathias Vaupel
Also filed as: VAUPEL MATHIAS
26 granted patents·1 pending application·81 citations·filing 2007–2020
94Inventor score
Top patents by PatentIndex Score
27 records- 0194US8148257B1Semiconductor structure and method for making sameBARTH HANS-JOACHIM·Filed 2010·Granted Apr 3, 2012·24 cites·6 claims
- 0288US10107867B2Sensor arrangement, battery cell and energy systemINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 23, 2018·3 cites·18 claims
- 0387US9748611B2Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 29, 2017·4 cites·5 claims
- 0487US8883565B2Separation of semiconductor devices from a wafer carrierVAUPEL MATHIAS·Filed 2011·Granted Nov 11, 2014·13 cites·32 claims
- 0586US8937380B1Die edge protection for pressure sensor packagesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jan 20, 2015·9 cites·15 claims
- 0683US9366593B2Pressure sensor package with integrated sealingINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 14, 2016·6 cites·26 claims
- 0782US9448130B2Sensor arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 20, 2016·6 cites·19 claims
- 0875US10677675B2Pressure sensor module having a sensor chip and passive devices within a housingINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jun 9, 2020·1 cites·19 claims
- 0973US10519030B2Transducer package with integrated sealingINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 31, 2019·2 cites·14 claims
- 1072US9099547B2Testing process for semiconductor devicesMARTENS STEFAN·Filed 2011·Granted Aug 4, 2015·4 cites·25 claims
- 1171US10947109B2Semiconductor component and method for producing sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 16, 2021·1 cites·24 claims
- 1270US8330274B2Semiconductor structure and method for making sameBARTH HANS-JOACHIM·Filed 2010·Granted Dec 11, 2012·2 cites·17 claims
- 1369US11287344B2Pressure sensor module having a sensor chip and passive devices within a housingINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 29, 2022·0 cites·17 claims
- 1469US9013014B2Chip package and a method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 21, 2015·2 cites·9 claims
- 1567US10060819B2Pressure sensor module having a sensor chip and passive devices within a housingINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 28, 2018·1 cites·18 claims
- 1662US8334202B2Device fabricated using an electroplating processPOHL JENS·Filed 2009·Granted Dec 18, 2012·2 cites·16 claims
- 1761US11655143B2Semiconductor component and method for producing sameINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 23, 2023·0 cites·25 claims
- 1859US8592999B2Semiconductor chip and method for fabricating the sameVAUPEL MATHIAS·Filed 2011·Granted Nov 26, 2013·1 cites·27 claims
- 1953US8786085B2Semiconductor structure and method for making sameINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 22, 2014·0 cites·19 claims
- 2052US8759207B2Semiconductor structure and method for making sameINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jun 24, 2014·0 cites·35 claims
- 2151US2015132614A1Sensor arrangement, energy system and methodINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 2247US10781095B2Molded lead frame sensor packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 22, 2020·0 cites·20 claims
- 2346US9196535B2Method and apparatus for separating semiconductor devices from a waferINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 24, 2015·0 cites·16 claims
- 2446US7989930B2Semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 2, 2011·0 cites·22 claims
- 2544US9984927B2Method and apparatus for separating semiconductor devices from a waferINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 29, 2018·0 cites·15 claims
- 2643US9147639B2Semiconductor dies having opposing sides with different reflectivityINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 29, 2015·0 cites·9 claims
- 2739US9312226B2Semiconductor device having an identification markINFINEON TECHNOLOGIES AG·Filed 2012·Granted Apr 12, 2016·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →