Inventor · disambiguated record
Geum Hee Yun
Also filed as: YUN GEUM H · YUN GEUM HEE
6 granted patents·19 pending applications·33 citations·filing 2003–2023
78Inventor score
Top patents by PatentIndex Score
25 records- 0184US8101248B2Composition for forming substrate, and prepreg and substrate using the sameYUN GEUM HEE·Filed 2010·Granted Jan 24, 2012·7 cites·19 claims
- 0279US8043876B2Light emitting diode package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Oct 25, 2011·9 cites·17 claims
- 0372US9035738B2Multilayer inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 19, 2015·2 cites·21 claims
- 0468US7279412B2Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Oct 9, 2007·15 cites·11 claims
- 0559US2024182696A1Dispersant and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0654US10923284B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Feb 16, 2021·0 cites·15 claims
- 0753US2024217885A1Dielectric slurry using dispersant and method of preparing dispersantSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0851US10283426B2Fan-out semiconductor package and photosensitive resin compositionSAMSUNG ELECTRO MECH·Filed 2017·Granted May 7, 2019·0 cites·17 claims
- 0951US2006257622A1Laminate for printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1050US2014154479A1Resin composition for printed circuit board, insulating film, prepreg and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1148US2018305509A1Light shielding resin compositionsSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 1248US2009262520A1Backlight unit using a thermoplastic resin boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1347US2015057393A1Insulating resin composition for printed circuit board and products manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1447US2014367147A1Insulating resin composition for printed circuit board, insulating film, prepreg and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1547US2006124228A1Apparatus and method for manufacturing copper clad laminate with improved peel strengthSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 1647US2008242787A1Eucryptite ceramic filler and insulating composite material containing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1746US2015147542A1Resin composition for printed circuit board and printed circuit board comprising the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1846US2015065608A1Insulating resin composition for printed circuit board and products manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1945US2015114693A1Insulating resin composition for printed circuit board and products manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2045US2014076198A1Epoxy resin composition for insulation, insulating film, prepreg, and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2144US2009141481A1Array light source using led and backlight unit including the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2242US2015027763A1Inorganic filler, and insulating resin composition, insulating film, prepreg and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2340US2019121235A1Photo-curable and thermo-curable resin composition and cured product thereofSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 2439US2010255742A1Heat Radiation Substrate and Illumination Module Substrate Having Hybrid LayerYUN GEUM HEE·Filed 2009·Application pending·0 cites
- 2536US2016237303A1Resin composition for printed circuit board, insulating film, and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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