Inventor · disambiguated record

Nobuaki Ikebe

Also filed as: IKEBE NOBUAKI

1 granted patent·1 citations·filing 2007–2007

16Inventor score

Technology areasH05K

Files withSONY CORP1

Top patents by PatentIndex Score

1 record

0150US7705351B2Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chipsSONY CORP·Filed 2007·Granted Apr 27, 2010·1 cites·6 claims

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