Inventor · disambiguated record
Tetsuro Sato
Also filed as: SATO TETSURO
38 granted patents·22 pending applications·197 citations·filing 1980–2025
96Inventor score
Files withMITSUI MINING & SMELTING CO13SONY GROUP CORP9MITSUI MINING & SMELTING CO LTD8NIPPON SHARYO LTD4SATO TETSURO4
Top patents by PatentIndex Score
60 records- 0185US9216472B2Friction stir welding apparatus comprising slide platesSATO TETSURO·Filed 2011·Granted Dec 22, 2015·9 cites·10 claims
- 0283US8497026B2Porous metal foil and production method thereforMATSUNAGA TETSUHIRO·Filed 2010·Granted Jul 30, 2013·3 cites·20 claims
- 0382US11525073B2Multilayer circuit board manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2017·Granted Dec 13, 2022·3 cites·12 claims
- 0477US11527415B2Multilayer circuit board manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2017·Granted Dec 13, 2022·2 cites·8 claims
- 0576US6541789B1High temperature superconductor Josephson junction element and manufacturing method for the sameINT SUPERCONDUCTIVITY TECH·Filed 1999·Granted Apr 1, 2003·27 cites·11 claims
- 0675US6905757B2Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminateMITSUI MINING & SMELTING CO·Filed 2003·Granted Jun 14, 2005·15 cites·9 claims
- 0774US10538256B2RailcarNIPPON SHARYO LTD·Filed 2015·Granted Jan 21, 2020·2 cites·15 claims
- 0869US12139592B2Resin composition comprising coated metal oxide particles, resin-attached metal foil, metal-clad laminated sheet, and capacitor elementMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·16 claims
- 0969US8304091B2Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereofMATSUNAGA TETSUHIRO·Filed 2005·Granted Nov 6, 2012·1 cites·20 claims
- 1067US8431224B2Resin composition for forming insulating layer of printed wiring boardSATO TETSURO·Filed 2008·Granted Apr 30, 2013·1 cites·8 claims
- 1163US11959775B2Information processing device and information processing method that enable simple calibrationSONY GROUP CORP·Filed 2021·Granted Apr 16, 2024·0 cites·17 claims
- 1263US10457297B2RailcarNIPPON SHARYO LTD·Filed 2015·Granted Oct 29, 2019·1 cites·14 claims
- 1363US9185130B2Transmission apparatus, reception apparatus, communication system, transmission method, and reception methodPANASONIC CORP·Filed 2013·Granted Nov 10, 2015·1 cites·16 claims
- 1462US4893988ASystem for damping lead-lag motion of rotor blades of helicopterFUJI HEAVY IND LTD·Filed 1988·Granted Jan 16, 1990·27 cites·6 claims
- 1561US6652962B1Resin-coated composite foil, production and use thereofMITSUI MINING & SMELTING CO·Filed 1999·Granted Nov 25, 2003·26 cites·4 claims
- 1659US11947119B2Display control device, display control method, and recording mediumSONY GROUP CORP·Filed 2021·Granted Apr 2, 2024·0 cites·13 claims
- 1759US6716530B2Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulation layer using the resin compound, and copper-clad laminate using themMITSUI MINING & SMELTING CO·Filed 2001·Granted Apr 6, 2004·7 cites·21 claims
- 1859US2025285784A1Insulated wire and structure using the samePROTERIAL LTD·Filed 2025·Application pending·0 cites
- 1958US11890853B2Resin layered product, dielectric layer, metal foil with resin, capacitor element, and printed wiring board with built-in capacitorMITSUI MINING & SMELTING CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·18 claims
- 2057US6831129B2Resin-coated copper foil, and printed wiring board using resin-coated copper foilMITSUI MINING & SMELTING CO·Filed 2002·Granted Dec 14, 2004·3 cites·16 claims
- 2157US2024214761A1Information processing device, information processing method, and programSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 2257US2024310471A1Information processing device, information processing method, and programSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 2356US12351698B2Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitorMITSUI MINING & SMELTING CO LTD·Filed 2020·Granted Jul 8, 2025·0 cites·17 claims
- 2456US2023320046A1Airbridge, superconducting circuit apparatus and method of fabrication the sameNEC CORP·Filed 2023·Application pending·0 cites
- 2556US2024175893A1Information processing apparatus, information processing method, and programSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 2654US2010068511A1Surface-treated copper foil, surface-treated copper foil with very thin primer resin layer, method for manufacturing the surface-treated copper foil, and method for manufacturing the surface-treated copper foil with very thin primer resin layerMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 2754US2025147576A1Information processing apparatus, information processing method, and information processing programSONY GROUP CORP·Filed 2023·Application pending·0 cites
- 2853US7144472B2Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production methodMITSUI MINING & SMELTING CO·Filed 2002·Granted Dec 5, 2006·6 cites·15 claims
- 2953US2024175717A1Information processing method, information processing apparatus, and programSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 3052US2024328790A1Inertial measurement device, method of operating inertial measurement device, imaging device, display device, and programSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 3151US11458400B2Information processing device, information processing method, and program for generating an added related to a predicted future behaviorSONY CORP·Filed 2019·Granted Oct 4, 2022·0 cites·10 claims
- 3251US11419210B2Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2013·Granted Aug 16, 2022·0 cites·11 claims
- 3351US2024430719A1Band estimating device and band estimate methodPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 3450US4384993AMethod of the production of immunoglobulin having high content of monomerCHEMO SERO THERAPEUT RES INST·Filed 1980·Granted May 24, 1983·14 cites·7 claims
- 3550US2024077938A1Information processing method, information processing device, and programSONY GROUP CORP·Filed 2021·Application pending·0 cites
- 3649US9453762B2Communication light detectorHITACHI METALS LTD·Filed 2014·Granted Sep 27, 2016·0 cites·4 claims
- 3749US5053665ARetaining structure of brush spring of electric motorASMO CO LTD·Filed 1990·Granted Oct 1, 1991·15 cites·1 claims
- 3848US7485361B2Multilayered printed wiring board and manufacturing method thereofMITSUI MINING & SMELTING CO·Filed 2004·Granted Feb 3, 2009·2 cites·7 claims
- 3948US2009317591A1Metal Composite Laminate for Producing Flexible Wiring Board and Flexible Wiring BoardMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 4045US11935865B2Semiconductor package manufacturing method, and adhesive sheet used thereinMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Mar 19, 2024·0 cites·19 claims
- 4145US11876070B2Semiconductor package manufacturing methodMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Jan 16, 2024·0 cites·19 claims
- 4245US9798921B2Wrinkle care support device and method for supporting wrinkle carePANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 24, 2017·0 cites·20 claims
- 4345US7927453B2Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layerMITSUI MINING & SMELTING CO·Filed 2006·Granted Apr 19, 2011·0 cites·3 claims
- 4445US5800722AMultilayer printed wiring board and process for manufacturing the sameMITSUI MINING & SMELTING CO·Filed 1996·Granted Sep 1, 1998·13 cites·4 claims
- 4544US12377887B2Fire-resistant floor structure of railroad vehicleNIPPON SHARYO LTD·Filed 2020·Granted Aug 5, 2025·0 cites·7 claims
- 4644US10559102B2Makeup simulation assistance apparatus, makeup simulation assistance method, and non-transitory computer-readable recording medium storing makeup simulation assistance programPANASONIC IP MAN CO LTD·Filed 2018·Granted Feb 11, 2020·0 cites·12 claims
- 4744US7163600B2Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layerMITSUI MINING & SMELTING CO·Filed 2002·Granted Jan 16, 2007·1 cites·1 claims
- 4844US2024099160A1Quantum device and its manufacturing methodNEC CORP·Filed 2020·Application pending·0 cites
- 4944US2023422636A1Quantum device and its manufacturing methodNEC CORP·Filed 2020·Application pending·0 cites
- 5044US2006059196A1Bit string check method and deviceIN4S INC·Filed 2003·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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