Inventor · disambiguated record
Garry L. Renner
Also filed as: RENNER GARRY · RENNER GARRY L
19 granted patents·2 pending applications·157 citations·filing 1999–2019
94Inventor score
Top patents by PatentIndex Score
21 records- 0195US9793057B2Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bondKEMET ELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·12 cites·20 claims
- 0293US8988857B2High aspect ratio stacked MLCC designMCCONNELL JOHN E·Filed 2011·Granted Mar 24, 2015·22 cites·77 claims
- 0392US9472342B2Leadless multi-layered ceramic capacitor stacksKEMET ELECTRONICS CORP·Filed 2013·Granted Oct 18, 2016·13 cites·28 claims
- 0491US9805872B2Multiple MLCC modulesKEMET ELECTRONICS CORP·Filed 2015·Granted Oct 31, 2017·5 cites·38 claims
- 0591US8902565B2Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastesMCCONNELL JOHN E·Filed 2011·Granted Dec 2, 2014·19 cites·18 claims
- 0691US7280342B1Low inductance high ESR capacitorKEMET ELECTRONICS CORP·Filed 2006·Granted Oct 9, 2007·28 cites·27 claims
- 0788US8717774B2Electronic passive deviceRANDALL MICHAEL S·Filed 2011·Granted May 6, 2014·12 cites·8 claims
- 0888US8331078B2Leaded multi-layer ceramic capacitor with low ESL and low ESRMCCONNELL JOHN E·Filed 2010·Granted Dec 11, 2012·12 cites·30 claims
- 0986US10381162B2Leadless stack comprising multiple componentsKEMET ELECTRONICS CORP·Filed 2017·Granted Aug 13, 2019·5 cites·32 claims
- 1084US7545623B2Interposer decoupling array having reduced electrical shortsKEMET ELECTRONICS CORP·Filed 2006·Granted Jun 9, 2009·11 cites·34 claims
- 1177US10068707B2Leadless multi-layered ceramic capacitor stacksKEMET ELECTRONICS CORP·Filed 2015·Granted Sep 4, 2018·2 cites·32 claims
- 1276US9881744B2Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bondsKEMET ELECTRONICS CORP·Filed 2014·Granted Jan 30, 2018·3 cites·36 claims
- 1367US8111524B2Electronic passive deviceRANDALL MICHAEL S·Filed 2008·Granted Feb 7, 2012·3 cites·14 claims
- 1461US6495808B1Method of making a ceramic heater with platinum heating elementFiled 2001·Granted Dec 17, 2002·9 cites·2 claims
- 1558US10229785B2Multi-layered ceramic capacitor with soft leaded moduleKEMET ELECTRONICS CORP·Filed 2013·Granted Mar 12, 2019·0 cites·48 claims
- 1657US10790094B2Method of forming a leadless stack comprising multiple componentsKEMET ELECTRONICS CORP·Filed 2019·Granted Sep 29, 2020·0 cites·10 claims
- 1756US11227719B2Leadless multi-layered ceramic capacitor stackKEMET ELECTRONICS CORP·Filed 2018·Granted Jan 18, 2022·0 cites·20 claims
- 1850US2008192452A1Passive electronic deviceRANDALL MICHAEL S·Filed 2007·Application pending·0 cites
- 1946US2008236717A1Process of manufacturing a multilayer device and device manufactured therebyGURAV ABHIJIT·Filed 2008·Application pending·0 cites
- 2040US10224149B2Bulk MLCC capacitor moduleKEMET ELECTRONICS CORP·Filed 2016·Granted Mar 5, 2019·0 cites·55 claims
- 2125US6205649B1Method of making a ceramic heater with platinum heating elementFiled 1999·Granted Mar 27, 2001·1 cites·7 claims
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