Inventor · disambiguated record
Koichi Hirano
Also filed as: HIRANO KOICHI
89 granted patents·52 pending applications·1,792 citations·filing 1975–2025
99Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD39PANASONIC IP MAN CO LTD36PANASONIC CORP24HIRANO KOICHI7MITSUBISHI PENCIL CO7
Top patents by PatentIndex Score
141 records- 0199US6392525B1Magnetic element and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted May 21, 2002·243 cites·7 claims
- 0298US9844133B2Flexible substrate including stretchable sheetPANASONIC IP MAN CO LTD·Filed 2016·Granted Dec 12, 2017·29 cites·19 claims
- 0398US6538210B2Circuit component built-in module, radio device having the same, and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 25, 2003·211 cites·26 claims
- 0497US7748110B2Method for producing connection memberPANASONIC CORP·Filed 2007·Granted Jul 6, 2010·50 cites·8 claims
- 0596US7258549B2Connection member and mount assembly and production method of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Aug 21, 2007·61 cites·23 claims
- 0695US6871396B2Transfer material for wiring substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 29, 2005·69 cites·22 claims
- 0794US10365172B2Tactile sensor that includes two sheets each having at least either flexibility or elasticityPANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 30, 2019·16 cites·14 claims
- 0893US7247178B2Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Jul 24, 2007·20 cites·21 claims
- 0993US6860004B2Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sinkMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 1, 2005·68 cites·3 claims
- 1092US7400512B2Module incorporating a capacitor, method for manufacturing the same, and capacitor used thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Granted Jul 15, 2008·20 cites·11 claims
- 1191US7394663B2Electronic component built-in module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 1, 2008·50 cites·15 claims
- 1290US8525172B2Flexible semiconductor devicePANASONIC CORP·Filed 2012·Granted Sep 3, 2013·9 cites·8 claims
- 1390US6570099B1Thermal conductive substrate and the method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 27, 2003·53 cites·20 claims
- 1490US6525921B1Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 25, 2003·53 cites·16 claims
- 1589US10228806B2Flexible touch sensor and method of manufacturing the samePANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 12, 2019·6 cites·18 claims
- 1689US6958535B2Thermal conductive substrate and semiconductor module using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 25, 2005·45 cites·24 claims
- 1788US8847229B2Flexible semiconductor device, method for manufacturing the same, image display device using the same and method for manufacturing the image display deviceSUZUKI TAKESHI·Filed 2012·Granted Sep 30, 2014·9 cites·26 claims
- 1888US7319599B2Module incorporating a capacitor, method for manufacturing the same, and capacitor used thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jan 15, 2008·33 cites·11 claims
- 1988US7126811B2Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 24, 2006·34 cites·30 claims
- 2088US6707671B2Power module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 16, 2004·42 cites·45 claims
- 2187US6522555B2Thermally conductive board, method of manufacturing the same, and power module with the same incorporated thereinMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 18, 2003·38 cites·12 claims
- 2287US6486006B2Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connectionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 26, 2002·39 cites·19 claims
- 2386US8435842B2Method for manufacturing flexible semiconductor deviceHIRANO KOICHI·Filed 2009·Granted May 7, 2013·9 cites·12 claims
- 2486US7910403B2Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the samePANASONIC CORP·Filed 2006·Granted Mar 22, 2011·12 cites·10 claims
- 2585US7013561B2Method for producing a capacitor-embedded circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 21, 2006·33 cites·14 claims
- 2685US6931725B2Circuit component built-in module, radio device having the same, and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 23, 2005·30 cites·31 claims
- 2783US7981528B2Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the samePANASONIC CORP·Filed 2007·Granted Jul 19, 2011·12 cites·29 claims
- 2882US7801491B2Wireless communication system and methodNEC CORP·Filed 2006·Granted Sep 21, 2010·14 cites·11 claims
- 2982US7038310B1Power module with improved heat dissipationMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 2, 2006·33 cites·21 claims
- 3082US5969966APower converting apparatus and method using a multiple three-phase PWM cycloconverter systemYASKAWA DENKI SEISAKUSHO KK·Filed 1996·Granted Oct 19, 1999·75 cites·20 claims
- 3181US8367488B2Manufacturing method of flexible semiconductor devicePANASONIC CORP·Filed 2010·Granted Feb 5, 2013·6 cites·16 claims
- 3280US6936774B2Wiring substrate produced by transfer material methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 30, 2005·17 cites·15 claims
- 3378US9383822B2Method for presenting tactile sensation and device thereforPANASONIC CORP·Filed 2013·Granted Jul 5, 2016·3 cites·11 claims
- 3478US9383821B2Method for presenting tactile sensation and device thereforPANASONIC CORP·Filed 2013·Granted Jul 5, 2016·3 cites·20 claims
- 3578US9176587B2Tactile sense presentation device and tactile sense presentation methodPANASONIC CORP·Filed 2013·Granted Nov 3, 2015·3 cites·23 claims
- 3678US4411175AMethod for making a ring-shaped moldBRIDGESTONE TIRE CO LTD·Filed 1980·Granted Oct 25, 1983·29 cites·19 claims
- 3777US8343822B2Flexible semiconductor device and method for manufacturing samePANASONIC CORP·Filed 2009·Granted Jan 1, 2013·5 cites·12 claims
- 3876US9713268B2Manufacturing method for electronic devicePANASONIC CORP·Filed 2015·Granted Jul 18, 2017·2 cites·11 claims
- 3976US7726545B2Flip chip mounting process and bump-forming process using electrically-conductive particles as nucleiPANASONIC CORP·Filed 2006·Granted Jun 1, 2010·8 cites·9 claims
- 4076US7157789B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 2, 2007·7 cites·30 claims
- 4176US4409457ASystem for manufacturing tire molding metal molds with electrical discharge machiningBRIDGEPORT TIRE CO LTD·Filed 1980·Granted Oct 11, 1983·19 cites·24 claims
- 4276US2025038369A1Battery and method of manufacturing samePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 4376US2025030136A1Battery and method of manufacturing samePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 4475US8975626B2Flexible semiconductor deviceSUZUKI TAKESHI·Filed 2009·Granted Mar 10, 2015·6 cites·12 claims
- 4575US8895373B2Method for manufacturing flexible semiconductor device having gate electrode disposed within an opening of a resin filmPANASONIC CORP·Filed 2013·Granted Nov 25, 2014·3 cites·8 claims
- 4674US6692818B2Method for manufacturing circuit board and circuit board and power conversion module using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 17, 2004·17 cites·7 claims
- 4774US2024363978A1Battery and battery manufacturing methodPANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 4874US2024274860A1Battery, method for manufacturing battery, and circuit boardPANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 4974US2024266610A1Battery, method for manufacturing battery, and circuit boardPANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 5073US8581247B2Flexible semiconductor device having gate electrode disposed within an opening of a resin filmSUZUKI TAKESHI·Filed 2010·Granted Nov 12, 2013·3 cites·16 claims
Showing the top 50 of 141 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →