Inventor · disambiguated record
Jin Hong
Also filed as: HONG JIN · HONG JIN HO · HONG JIN Y
36 granted patents·11 pending applications·983 citations·filing 2002–2022
98Inventor score
Files withNIKE INC23SAMSUNG ELECTRO MECH18CONVERSE INC4HYUNDAI MOTOR CO LTD1SAMSUNG ELECTRO MECHANICS LTD1
Top patents by PatentIndex Score
47 records- 0195USD959118SShoeCONVERSE INC·Filed 2020·Granted Aug 2, 2022·33 cites·1 claims
- 0295USD895946SShoeNIKE INC·Filed 2019·Granted Sep 15, 2020·68 cites·1 claims
- 0395USD843704SShoe outsoleNIKE INC·Filed 2017·Granted Mar 26, 2019·128 cites·1 claims
- 0494US11521801B2Solid electrolyte capacitor and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2020·Granted Dec 6, 2022·5 cites·16 claims
- 0594USD896486SShoeNIKE INC·Filed 2019·Granted Sep 22, 2020·52 cites·1 claims
- 0694USD895945SShoeNIKE INC·Filed 2019·Granted Sep 15, 2020·53 cites·1 claims
- 0794USD853701SShoeNIKE INC·Filed 2018·Granted Jul 16, 2019·75 cites·1 claims
- 0894USD851906SShoeNIKE INC·Filed 2018·Granted Jun 25, 2019·92 cites·1 claims
- 0993USD905390SShoeNIKE INC·Filed 2019·Granted Dec 22, 2020·44 cites·1 claims
- 1091USD908330SShoeNIKE INC·Filed 2019·Granted Jan 26, 2021·37 cites·1 claims
- 1191USD905399SShoeNIKE INC·Filed 2019·Granted Dec 22, 2020·36 cites·1 claims
- 1291USD846243SShoe midsoleNIKE INC·Filed 2017·Granted Apr 23, 2019·46 cites·1 claims
- 1390USD851381SShoeNIKE INC·Filed 2018·Granted Jun 18, 2019·42 cites·1 claims
- 1489USD909736SShoeNIKE INC·Filed 2020·Granted Feb 9, 2021·15 cites·1 claims
- 1587USD989459SShoeCONVERSE INC·Filed 2020·Granted Jun 20, 2023·12 cites·1 claims
- 1686USD909037SShoeNIKE INC·Filed 2020·Granted Feb 2, 2021·12 cites·1 claims
- 1786USD905398SShoeNIKE INC·Filed 2019·Granted Dec 22, 2020·25 cites·1 claims
- 1885USD952997SShoeNIKE INC·Filed 2018·Granted May 31, 2022·22 cites·1 claims
- 1985USD809769SShoe upperNIKE INC·Filed 2017·Granted Feb 13, 2018·29 cites·1 claims
- 2084USD965963SShoeCONVERSE INC·Filed 2020·Granted Oct 11, 2022·11 cites·1 claims
- 2184USD785922SShoe upperNIKE INC·Filed 2016·Granted May 9, 2017·28 cites·1 claims
- 2283USD910303SShoeNIKE INC·Filed 2019·Granted Feb 16, 2021·21 cites·1 claims
- 2382US6601435B2Method and device for estimating a friction coefficient between a tire and a road surfaceHYUNDAI MOTOR CO LTD·Filed 2002·Granted Aug 5, 2003·38 cites·22 claims
- 2478USD851902SShoeNIKE INC·Filed 2018·Granted Jun 25, 2019·18 cites·1 claims
- 2577USD855962SShoe upperNIKE INC·Filed 2017·Granted Aug 13, 2019·18 cites·1 claims
- 2674USD851892SShoeNIKE INC·Filed 2018·Granted Jun 25, 2019·15 cites·1 claims
- 2772USD990101SShoeCONVERSE INC·Filed 2020·Granted Jun 27, 2023·5 cites·1 claims
- 2871US11942279B2Tantalum capacitorSAMSUNG ELECTRO MECH·Filed 2022·Granted Mar 26, 2024·0 cites·24 claims
- 2966US12014883B2Tantalum capacitor including conductive polymer layer having a fillerSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 18, 2024·0 cites·23 claims
- 3060US11495392B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 8, 2022·0 cites·16 claims
- 3157US9288902B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Mar 15, 2016·0 cites·5 claims
- 3253US9236177B2Common mode filterSAMSUNG ELECTRO MECH·Filed 2013·Granted Jan 12, 2016·0 cites·5 claims
- 3352US11688554B2Tantalum capacitor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2021·Granted Jun 27, 2023·0 cites·32 claims
- 3452US2015097647A1Magnetic substrate and method of manufacturing the same, bonding structure between magnetic substrate and insulating material, and chip component having the bonding structureSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3552US2014080941A1Insulating composition for multilayer printed circuit board, method for preparing the same, and multilayer printed circuit board comprising the same as insulating layerSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3651US2015114696A1Core substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3751US2015114691A1Core substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3850US2014154479A1Resin composition for printed circuit board, insulating film, prepreg and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3950US2020090848A1Magnetic substrate and method of manufacturing the same, bonding structure between magnetic substrate and insulating material, and chip component having the bonding structureSAMSUNG ELECTRO MECH·Filed 2019·Application pending·0 cites
- 4048US2015053457A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECHANICS LTD·Filed 2014·Application pending·0 cites
- 4147US11737509B2Article of footwearNIKE INC·Filed 2020·Granted Aug 29, 2023·0 cites·18 claims
- 4245US2017086292A1Prepreg and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 4344US2022013302A1Solid electrolytic capacitorSAMSUNG ELECTRO MECH·Filed 2020·Application pending·0 cites
- 4443US10847300B2Inductor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 24, 2020·0 cites·17 claims
- 4542USD856655SShoe upperNIKE INC·Filed 2017·Granted Aug 20, 2019·3 cites·1 claims
- 4642US2015027763A1Inorganic filler, and insulating resin composition, insulating film, prepreg and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4741US2007141741A1Semiconductor laminated structure and method of manufacturing nitirde semiconductor crystal substrate and nitirde semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →