Inventor · disambiguated record
Hisayuki Abe
Also filed as: ABE HISAYUKI
47 granted patents·7 pending applications·354 citations·filing 1997–2021
97Inventor score
Top patents by PatentIndex Score
54 records- 0195US7868464B2Multilayer substrate and manufacturing method thereofTDK CORP·Filed 2005·Granted Jan 11, 2011·40 cites·23 claims
- 0294US9768154B2Semiconductor package and manufacturing method thereforTDK CORP·Filed 2016·Granted Sep 19, 2017·11 cites·16 claims
- 0393US9818736B1Method for producing semiconductor packageTDK CORP·Filed 2017·Granted Nov 14, 2017·11 cites·4 claims
- 0492US11031330B2Electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2020·Granted Jun 8, 2021·3 cites·13 claims
- 0591US8009012B2Stacked electronic part and method of manufacturing the sameTDK CORP·Filed 2008·Granted Aug 30, 2011·15 cites·3 claims
- 0688US6402013B2Thermosetting soldering flux and soldering processSENJU METAL INDUSTRY CO·Filed 2000·Granted Jun 11, 2002·46 cites·20 claims
- 0788US6147573AMultilayer electronic part with planar terminal electrodesTDK CORP·Filed 1997·Granted Nov 14, 2000·56 cites·10 claims
- 0884US11869834B2Electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2021·Granted Jan 9, 2024·1 cites·12 claims
- 0983US10867898B2Electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2018·Granted Dec 15, 2020·3 cites·13 claims
- 1083US10374301B2Wiring componentTDK CORP·Filed 2017·Granted Aug 6, 2019·4 cites·9 claims
- 1183US6915944B1Soldering flux, solder paste and method of solderingTDK CORP·Filed 2000·Granted Jul 12, 2005·29 cites·60 claims
- 1282US8553390B2Ceramic electronic componentTANIGUCHI SUSUMU·Filed 2011·Granted Oct 8, 2013·9 cites·3 claims
- 1381US8254083B2Ceramic electronic component and method for producing sameSAKURAI TAKASHI·Filed 2010·Granted Aug 28, 2012·6 cites·6 claims
- 1478USD816639SMicrophone for wireless communications deviceJVC KENWOOD CORP·Filed 2016·Granted May 1, 2018·17 cites·1 claims
- 1576US10362686B2Lead-free solder and electronic component built-in moduleTDK CORP·Filed 2015·Granted Jul 23, 2019·2 cites·2 claims
- 1675USD796467SPortable wireless communication deviceJVC KENWOOD CORP·Filed 2016·Granted Sep 5, 2017·17 cites·1 claims
- 1772US9293421B2Electronic component moduleTDK CORP·Filed 2015·Granted Mar 22, 2016·2 cites·6 claims
- 1872US9257402B2Terminal structure, and semiconductor element and module substrate comprising the sameTDK CORP·Filed 2013·Granted Feb 9, 2016·3 cites·7 claims
- 1972US6008151ANon-magnetic ceramics and ceramic multilayer partsTDK CORP·Filed 1998·Granted Dec 28, 1999·36 cites·5 claims
- 2070US6568054B1Method of producing a multilayer electronic partTKD CORP·Filed 2000·Granted May 27, 2003·15 cites·3 claims
- 2169US9620156B2Magnetic head deviceTDK CORP·Filed 2016·Granted Apr 11, 2017·2 cites·12 claims
- 2268US9070606B2Terminal structure and semiconductor deviceTDK CORP·Filed 2013·Granted Jun 30, 2015·2 cites·6 claims
- 2367US7547975B2Module with embedded semiconductor IC and method of fabricating the moduleTDK CORP·Filed 2004·Granted Jun 16, 2009·14 cites·25 claims
- 2466US9640500B2Terminal structure and semiconductor deviceTDK CORP·Filed 2013·Granted May 2, 2017·2 cites·9 claims
- 2563US11410855B2Method of producing electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2020·Granted Aug 9, 2022·0 cites·13 claims
- 2660US11668008B2Sheet material, metal mesh, wiring substrate, display device and manufacturing methods thereforTDK CORP·Filed 2020·Granted Jun 6, 2023·0 cites·11 claims
- 2758US8291585B2Method for manufacturing electronic componentONODERA KO·Filed 2008·Granted Oct 23, 2012·3 cites·14 claims
- 2855US10354973B2Method for producing semiconductor chipTDK CORP·Filed 2018·Granted Jul 16, 2019·0 cites·11 claims
- 2953US10784122B2Method of producing electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2018·Granted Sep 22, 2020·0 cites·10 claims
- 3053US9144166B2Electronic componentTDK CORP·Filed 2013·Granted Sep 22, 2015·0 cites·3 claims
- 3153US8787028B2Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structureTDK CORP·Filed 2012·Granted Jul 22, 2014·0 cites·11 claims
- 3252US10163847B2Method for producing semiconductor packageTDK CORP·Filed 2017·Granted Dec 25, 2018·0 cites·19 claims
- 3351US12439519B2Mounting board and circuit boardTDK CORP·Filed 2021·Granted Oct 7, 2025·0 cites·18 claims
- 3451US10968519B2Sheet material, metal mesh, wiring substrate, display device and manufacturing methods thereforTDK CORP·Filed 2018·Granted Apr 6, 2021·0 cites·2 claims
- 3550US11466368B2Sheet material, metal mesh and manufacturing methods thereofTDK CORP·Filed 2018·Granted Oct 11, 2022·0 cites·15 claims
- 3650US10392704B2Coating electronic componentTDK CORP·Filed 2017·Granted Aug 27, 2019·0 cites·12 claims
- 3750US9320146B2Electronic circuit module componentTDK CORP·Filed 2013·Granted Apr 19, 2016·0 cites·9 claims
- 3850US8449696B2Rare-earth sintered magnet containing a nitride, rotator containing rare-earth sintered magnet, and reciprocating motor containing rare-earth sintered magnetYOSHIDA KENICHI·Filed 2011·Granted May 28, 2013·0 cites·8 claims
- 3949US10205250B2Junction structure for an electronic device and electronic deviceTDK CORP·Filed 2014·Granted Feb 12, 2019·0 cites·11 claims
- 4047US8970037B2Terminal structure, and semiconductor element and module substrate comprising the sameTDK CORP·Filed 2013·Granted Mar 3, 2015·0 cites·5 claims
- 4147US2006273451A1Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing methodTDK CORP·Filed 2006·Application pending·0 cites
- 4246US10304779B2Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereofTDK CORP·Filed 2017·Granted May 28, 2019·0 cites·7 claims
- 4346US9258905B2Lead-free solder and electronic component built-in moduleYASUI TSUTOMU·Filed 2011·Granted Feb 9, 2016·0 cites·2 claims
- 4446US8183463B2Plating film, printed wiring board, and module substrateSATO ATSUSHI·Filed 2010·Granted May 22, 2012·0 cites·15 claims
- 4546USD644621SRadio two-way communications deviceKENWOOD CORP·Filed 2010·Granted Sep 6, 2011·5 cites·1 claims
- 4646US2012018191A1Coating and electronic componentYOSHIDA KENICHI·Filed 2011·Application pending·0 cites
- 4745US9564179B2Rectifying component for magnetic disk deviceTDK CORP·Filed 2016·Granted Feb 7, 2017·0 cites·5 claims
- 4845US2010178737A1Semiconductor IC and Its Manufacturing Method, and Module with Embedded Semiconductor IC and Its Manufacturing MethodTDK CORP·Filed 2010·Application pending·0 cites
- 4941US2011171378A1Method for producing covered particlesTDK CORP·Filed 2011·Application pending·0 cites
- 5040US8383964B2Terminal structure, printed wiring board, module substrate, and electronic deviceTDK CORP·Filed 2010·Granted Feb 26, 2013·0 cites·8 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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