Inventor · disambiguated record
Darryl Kuo
Also filed as: KUO DARRYL
6 granted patents·12 citations·filing 2011–2020
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0190US8487410B2Through-silicon vias for semicondcutor substrate and method of manufactureYU CHEN-HUA·Filed 2011·Granted Jul 16, 2013·8 cites·9 claims
- 0277US10784162B2Method of making a semiconductor component having through-silicon viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·1 cites·20 claims
- 0373US11545392B2Semiconductor component having through-silicon viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 0473US10115634B2Semiconductor component having through-silicon vias and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 30, 2018·1 cites·20 claims
- 0568US9418923B2Semiconductor component having through-silicon vias and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·1 cites·7 claims
- 0668US8575725B2Through-silicon vias for semicondcutor substrate and method of manufactureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 5, 2013·1 cites·21 claims
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