Inventor · disambiguated record
Ebin Liao
Also filed as: LIAO EBIN
21 granted patents·6 pending applications·49 citations·filing 2006–2024
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15TAIWAN SEMICONDUCTOR MFG3AGENCY SCIENCE TECH & RES2YU CHEN-HUA2GEORGIA TECH RES INST1
Top patents by PatentIndex Score
27 records- 0192US10269611B1Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·10 cites·20 claims
- 0290US8487410B2Through-silicon vias for semicondcutor substrate and method of manufactureYU CHEN-HUA·Filed 2011·Granted Jul 16, 2013·8 cites·9 claims
- 0386US8803322B2Through substrate via structures and methods of forming the sameYANG KU-FENG·Filed 2011·Granted Aug 12, 2014·7 cites·20 claims
- 0483US9263382B2Through substrate via structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·5 cites·20 claims
- 0583US9087878B2Device with through-silicon via (TSV) and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 21, 2015·5 cites·20 claims
- 0682US8525343B2Device with through-silicon via (TSV) and method of forming the sameYU CHEN-HUA·Filed 2010·Granted Sep 3, 2013·5 cites·21 claims
- 0777US10784162B2Method of making a semiconductor component having through-silicon viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·1 cites·20 claims
- 0876US9899467B2Semiconductor devices, methods of manufacture thereof, and capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 20, 2018·3 cites·19 claims
- 0975US2024347506A1Method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1073US11545392B2Semiconductor component having through-silicon viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 1173US10115634B2Semiconductor component having through-silicon vias and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 30, 2018·1 cites·20 claims
- 1271US10727294B2Semiconductor devices, methods of manufacture thereof, and capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·1 cites·20 claims
- 1369US10672737B2Three-dimensional integrated circuit structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·1 cites·20 claims
- 1468US10867831B1Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·0 cites·20 claims
- 1568US9418923B2Semiconductor component having through-silicon vias and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·1 cites·7 claims
- 1668US8575725B2Through-silicon vias for semicondcutor substrate and method of manufactureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 5, 2013·1 cites·21 claims
- 1766US12051672B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 30, 2024·0 cites·20 claims
- 1859US10748803B2Method and apparatus for bonding semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·0 cites·20 claims
- 1952US9514986B2Device with capped through-substrate via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 6, 2016·0 cites·19 claims
- 2050US10872874B2Bonding apparatus and method of bonding substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 22, 2020·0 cites·20 claims
- 2150US9847256B2Methods for forming a device having a capped through-substrate via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 19, 2017·0 cites·20 claims
- 2242US2010052064A1Method for straining a semiconductor wafer and a wafer substrate unit used thereinAGENCY SCIENCE TECH & RES·Filed 2006·Application pending·0 cites
- 2340US2010187682A1Electronic package and method of assembling the samePINJALA DAMARUGANATH·Filed 2007·Application pending·0 cites
- 2439US2006197232A1Planar microspring integrated circuit chip interconnection to next levelGEORGIA TECH RES INST·Filed 2006·Application pending·0 cites
- 2537US2009116207A1Method for micro component self-assemblyLIM SAMUEL LONG YAK·Filed 2007·Application pending·0 cites
- 2636US8729695B2Wafer level package and a method of forming a wafer level packagePREMACHANDRAN CHIRAYARIKATHU VEEDU SANKARAPILLAI·Filed 2009·Granted May 20, 2014·0 cites·20 claims
- 2733US2013037603A1Method of Forming a Bonded StructureAGENCY SCIENCE TECH & RES·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →