Inventor · disambiguated record
David Jandzinski
Also filed as: JANDZINSKI DAVID · JANDZINSKI DAVID A
15 granted patents·2 pending applications·664 citations·filing 1995–2021
94Inventor score
Top patents by PatentIndex Score
17 records- 0197US10882740B2Wafer-level package with enhanced performance and manufacturing method thereofQORVO US INC·Filed 2019·Granted Jan 5, 2021·25 cites·16 claims
- 0297US9613831B2Encapsulated dies with enhanced thermal performanceRF MICRO DEVICES INC·Filed 2015·Granted Apr 4, 2017·64 cites·27 claims
- 0397US5661088AElectronic component and method of packagingMOTOROLA INC·Filed 1996·Granted Aug 26, 1997·175 cites·19 claims
- 0494US9960145B2Flip chip module with enhanced propertiesQORVO US INC·Filed 2016·Granted May 1, 2018·15 cites·25 claims
- 0593US5789815AThree dimensional semiconductor package having flexible appendagesMOTOROLA INC·Filed 1996·Granted Aug 4, 1998·167 cites·15 claims
- 0691US8296941B2Conformal shielding employing segment buildupHINER DAVID J·Filed 2011·Granted Oct 30, 2012·10 cites·16 claims
- 0789US5892661ASmartcard and method of makingMOTOROLA INC·Filed 1996·Granted Apr 6, 1999·127 cites·24 claims
- 0888US8409658B2Conformal shielding process using flush structuresHINER DAVID J·Filed 2007·Granted Apr 2, 2013·10 cites·18 claims
- 0985US10905007B1Contact pads for electronic substrates and related methodsQORVO US INC·Filed 2020·Granted Jan 26, 2021·2 cites·16 claims
- 1081US5816478AFluxless flip-chip bond and a method for makingMOTOROLA INC·Filed 1995·Granted Oct 6, 1998·64 cites·8 claims
- 1176US10773952B2Wafer-level package with enhanced performanceQORVO US INC·Filed 2017·Granted Sep 15, 2020·2 cites·22 claims
- 1274US10020206B2Encapsulated dies with enhanced thermal performanceRF MICRO DEVICES INC·Filed 2016·Granted Jul 10, 2018·2 cites·19 claims
- 1367US11765826B2Method of fabricating contact pads for electronic substratesQORVO US INC·Filed 2021·Granted Sep 19, 2023·0 cites·19 claims
- 1465US10888040B2Double-sided module with electromagnetic shieldingQORVO US INC·Filed 2018·Granted Jan 5, 2021·1 cites·14 claims
- 1551US2010199492A1Conformal shielding employing segment buildupRF MICRO DEVICES INC·Filed 2010·Application pending·0 cites
- 1647US2014146489A1Surface finish for conductive features on substratesRF MICRO DEVICES INC·Filed 2013·Application pending·0 cites
- 1742US10043707B2Additive conductor redistribution layer (ACRL)RF MICRO DEVICES INC·Filed 2013·Granted Aug 7, 2018·0 cites·22 claims
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