Inventor · disambiguated record

Cing-He Chen

Also filed as: CHEN CING-HE

2 granted patents·1 pending application·8 citations·filing 2013–2022

54Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD2 TAIWAN SEMICONDUCTOR MFG1

Top patents by PatentIndex Score

3 records

0178US11728238B2Semiconductor package with heat dissipation films and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 15, 2023·2 cites·21 claims
0278US8945983B2System and method to improve package and 3DIC yield in underfill processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 3, 2015·6 cites·20 claims
0364US2022336321A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →