Inventor · disambiguated record
Robert Faul
Also filed as: FAUL ROBERT
4 granted patents·19 citations·filing 2011–2020
62Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0185US8563358B2Method of producing a chip package, and chip packageLANDESBERGER CHRISTOF·Filed 2011·Granted Oct 22, 2013·19 cites·30 claims
- 0239US11764122B23D flex-foil packageFRAUNHOFER GES FORSCHUNG·Filed 2020·Granted Sep 19, 2023·0 cites·16 claims
- 0339US11615996B2Thin dual foil package including multiple foil substratesFRAUNHOFER GES FORSCHUNG·Filed 2020·Granted Mar 28, 2023·0 cites·23 claims
- 0439US11521919B2Flex-foil package with coplanar topology for high-frequency signalsFRAUNHOFER GES FORSCHUNG·Filed 2020·Granted Dec 6, 2022·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →