Inventor · disambiguated record
Shigeaki Sakatani
Also filed as: SAKATANI SHIGEAKI
36 granted patents·12 pending applications·112 citations·filing 2006–2021
96Inventor score
Top patents by PatentIndex Score
48 records- 0194US11577490B2Heat insulating material, method for manufacturing same, and electronic equipment and automobile using samePANASONIC IP MAN CO LTD·Filed 2019·Granted Feb 14, 2023·9 cites·11 claims
- 0291US7775446B2Card type information device and method for manufacturing samePANASONIC CORP·Filed 2007·Granted Aug 17, 2010·31 cites·11 claims
- 0388US11905647B2Thermal insulation sheet and method for producing the same, and electronic device and battery unitPANASONIC IP MAN CO LTD·Filed 2021·Granted Feb 20, 2024·1 cites·20 claims
- 0488US10377637B2Aerogel and manufacturing method thereofPANASONIC IP MAN CO LTD·Filed 2015·Granted Aug 13, 2019·2 cites·5 claims
- 0587US8598464B2Soldering material and electronic component assemblySAKATANI SHIGEAKI·Filed 2010·Granted Dec 3, 2013·10 cites·4 claims
- 0686US10042092B2Heat-insulation material and production method thereofPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 7, 2018·2 cites·10 claims
- 0785US10384420B2Heat-insulation material and production method thereofPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 20, 2019·3 cites·7 claims
- 0885US7935892B2Electronic circuit device and method for manufacturing samePANASONIC CORP·Filed 2006·Granted May 3, 2011·14 cites·11 claims
- 0984US10875776B2Method for manufacturing aerogelPANASONIC IP MAN CO LTD·Filed 2019·Granted Dec 29, 2020·1 cites·9 claims
- 1082US10259924B2Silica aerogel, heat-insulation material, and method for producing silica aerogelPANASONIC IP MAN CO LTD·Filed 2016·Granted Apr 16, 2019·1 cites·10 claims
- 1178US11302988B2Battery, battery module and method for producing separatorPANASONIC IP MAN CO LTD·Filed 2017·Granted Apr 12, 2022·1 cites·18 claims
- 1278US8810035B2Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure bodyNAKAMURA TAICHI·Filed 2011·Granted Aug 19, 2014·5 cites·4 claims
- 1376US10710332B2Heat-insulation sheet, electronic device using same, and method for producing heat-insulation sheetPANASONIC IP MAN CO LTD·Filed 2019·Granted Jul 14, 2020·0 cites·7 claims
- 1476US9707737B2Composite material and electronic apparatusPANASONIC IP MAN CO LTD·Filed 2015·Granted Jul 18, 2017·2 cites·11 claims
- 1576US8378472B2Mounting structure for semiconductor element with underfill resinPANASONIC CORP·Filed 2008·Granted Feb 19, 2013·7 cites·9 claims
- 1675US8138426B2Mounting structureMATSUNO KOSO·Filed 2008·Granted Mar 20, 2012·9 cites·14 claims
- 1773US9663376B2Xerogel production methodPANASONIC IP MAN CO LTD·Filed 2015·Granted May 30, 2017·1 cites·8 claims
- 1870US8450859B2Semiconductor device mounted structure and its manufacturing methodOHASHI NAOMICHI·Filed 2009·Granted May 28, 2013·5 cites·12 claims
- 1969US10543660B2Heat-insulation sheet, electronic device using same, and method for producing heat-insulation sheetPANASONIC IP MAN CO LTD·Filed 2016·Granted Jan 28, 2020·1 cites·20 claims
- 2068US12195911B2Heat insulating sheet and method of manufacturing thereof, and electronic device and battery unit using heat insulating sheetPANASONIC IP MAN CO LTD·Filed 2020·Granted Jan 14, 2025·0 cites·10 claims
- 2166US8410377B2Mounted structureYAMAGUCHI ATSUSHI·Filed 2008·Granted Apr 2, 2013·3 cites·4 claims
- 2265US9936539B2Seat heaterPANASONIC IP MAN CO LTD·Filed 2014·Granted Apr 3, 2018·1 cites·11 claims
- 2362US11015286B2Thermal insulation sheet and method for producing the same, and electronic device and battery unitPANASONIC IP MAN CO LTD·Filed 2018·Granted May 25, 2021·0 cites·6 claims
- 2461US11230475B2Hydrophobic treatment method and manufacturing method for sheet-like member using methodPANASONIC IP MAN CO LTD·Filed 2017·Granted Jan 25, 2022·0 cites·12 claims
- 2558US11293583B2Heat-insulation material, heat-insulation structure using same, and process for producing samePANASONIC IP MAN CO LTD·Filed 2018·Granted Apr 5, 2022·0 cites·2 claims
- 2658US8718109B2Laser array light source unitSARUWATARI NAOTO·Filed 2012·Granted May 6, 2014·2 cites·12 claims
- 2755US8179686B2Mounted structural body and method of manufacturing the sameSAKATANI SHIGEAKI·Filed 2008·Granted May 15, 2012·1 cites·12 claims
- 2854US2019145571A1Insulating material and device using insulating materialPANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 2952US8012379B2Electroconductive bonding material and electric/electronic device using the samePANASONIC CORP·Filed 2010·Granted Sep 6, 2011·0 cites·19 claims
- 3051US2019144701A1Heat insulating material and method for forming coating of the samePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 3149US2019178434A1Heat insulating material and heat insulating structure using samePANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
- 3248US8345444B2Structure with electronic component mounted therein and method for manufacturing such structurePANASONIC CORP·Filed 2008·Granted Jan 1, 2013·0 cites·14 claims
- 3346US8421246B2Joint structure and electronic componentFURUSAWA AKIO·Filed 2009·Granted Apr 16, 2013·0 cites·11 claims
- 3444US2019177911A1Heat insulatorPANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 3543US9604431B2Composite sheet, mounting structure including the composite sheet and electronic apparatus including the mounting structurePANASONIC CORP·Filed 2014·Granted Mar 28, 2017·0 cites·21 claims
- 3643US2009236036A1Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable compositionMIYAKAWA HIDENORI·Filed 2007·Application pending·0 cites
- 3742US8268718B2Bonded structure and manufacturing method for bonded structureNAKAMURA TAICHI·Filed 2011·Granted Sep 18, 2012·0 cites·3 claims
- 3842US2009032293A1Electroconductive Bonding Material and Electric/Electronic Device Using the SameMIYAKAWA HIDENORI·Filed 2006·Application pending·0 cites
- 3941US8552307B2Mounting structureHINE KIYOHIRO·Filed 2011·Granted Oct 8, 2013·0 cites·7 claims
- 4041US2018156550A1Heat insulation material and device using samePANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 4140US8338966B2Joint structure, joining material, and method for producing joining material containing bismuthFURUSAWA AKIO·Filed 2010·Granted Dec 25, 2012·0 cites·8 claims
- 4239US9937683B2Composite sheet, production method thereof and electronic apparatus using the samePANASONIC IP MAN CO LTD·Filed 2015·Granted Apr 10, 2018·0 cites·17 claims
- 4339US2019001293A1Aerogels, materials using same, and methods for producing samePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 4438US8691377B2Semiconductor deviceNAKAMURA TAICHI·Filed 2010·Granted Apr 8, 2014·0 cites·6 claims
- 4537US2010148367A1Semiconductor device and method for fabricating the samePANASONIC CORP·Filed 2010·Application pending·0 cites
- 4637US2011042817A1Solder joint structure, and joining method of the samePANASONIC CORP·Filed 2010·Application pending·0 cites
- 4737US2012153461A1Semiconductor component, semiconductor wafer component, manufacturing method of semiconductor component, and manufacturing method of joining structureKITAURA HIDETOSHI·Filed 2010·Application pending·0 cites
- 4832US2016060808A1Heat insulation sheet and method of producing the samePANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
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