Inventor · disambiguated record
Akira Tai
Also filed as: TAI AKIRA
13 granted patents·3 pending applications·117 citations·filing 1987–2010
90Inventor score
Top patents by PatentIndex Score
16 records- 0176US5408112ASemiconductor strain sensor having improved resistance to bonding strain effectsNIPPON DENSO CO·Filed 1993·Granted Apr 18, 1995·36 cites·28 claims
- 0268US8441122B2Semiconductor device having semiconductor chip and metal plateFUKUOKA DAISUKE·Filed 2010·Granted May 14, 2013·3 cites·3 claims
- 0367US5507182ASemiconductor accelerometer with damperless structureNIPPON DENSO CO·Filed 1994·Granted Apr 16, 1996·24 cites·35 claims
- 0467US5325164AFixing device with pulling rollersKONISHIROKU PHOTO IND·Filed 1992·Granted Jun 28, 1994·16 cites·7 claims
- 0566US5749031ADeveloping apparatus in use with an image forming apparatusKONISHIROKU PHOTO IND·Filed 1996·Granted May 5, 1998·20 cites·7 claims
- 0659US7105910B2Semiconductor device having SOI constructionDENSO CORP·Filed 2004·Granted Sep 12, 2006·9 cites·35 claims
- 0756US7906829B2Semiconductor device having first and second insulation separation regionsDENSO CORP·Filed 2006·Granted Mar 15, 2011·1 cites·20 claims
- 0855US7796442B2Nonvolatile semiconductor memory device and method of erasing and programming the sameDENSO CORP·Filed 2008·Granted Sep 14, 2010·1 cites·11 claims
- 0944US4881103ADeveloping apparatusKONISHIROKU PHOTO IND·Filed 1987·Granted Nov 14, 1989·6 cites·19 claims
- 1042US2006071284A1Easily crack checkable semiconductor deviceDENSO CORP·Filed 2005·Application pending·0 cites
- 1141US6818942B2Non-volatile semiconductor storage device having conductive layer surrounding floating gateDENSO CORP·Filed 2002·Granted Nov 16, 2004·1 cites·20 claims
- 1237US2005189617A1Bipolar transistor having multiple interceptorsDENSO CORP·Filed 2005·Application pending·0 cites
- 1330US4990694AOptically active dimethyl heptanediolsWAKO PURE CHEM IND LTD·Filed 1990·Granted Feb 5, 1991·0 cites·2 claims
- 1429US2011207264A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2010·Application pending·0 cites
- 1528US8405218B2Semiconductor device and method of patterning resin insulation layer on substrate of the sameTOMISAKA MANABU·Filed 2010·Granted Mar 26, 2013·0 cites·8 claims
- 1624US8263490B2Formation method of metallic electrode of semiconductor device and metallic electrode formation apparatusTOMISAKA MANABU·Filed 2010·Granted Sep 11, 2012·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →