Inventor · disambiguated record
Takashi Makinoshima
Also filed as: MAKINOSHIMA TAKASHI
19 granted patents·39 pending applications·64 citations·filing 2005–2022
91Inventor score
Top patents by PatentIndex Score
58 records- 0194US7871554B2Process for producing polyimide filmMITSUBISHI GAS CHEMICAL CO·Filed 2006·Granted Jan 18, 2011·44 cites·12 claims
- 0285US7659360B2Low water-absorptive polyimide resin and method for producing sameMITSUBISHI GAS CHEMICAL CO·Filed 2005·Granted Feb 9, 2010·6 cites·14 claims
- 0383US11572430B2Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Feb 7, 2023·1 cites·1 claims
- 0482US11243467B2Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Feb 8, 2022·2 cites·13 claims
- 0576US10577323B2Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying compound or resinMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Mar 3, 2020·1 cites·12 claims
- 0676US10294183B2Compound, resin, material for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying the compound or resinMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted May 21, 2019·1 cites·25 claims
- 0775US11137686B2Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and production method thereof, and resist pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Oct 5, 2021·2 cites·10 claims
- 0875US10747112B2Compound, resin, and purification method thereof, material for forming underlayer film for lithography, composition for forming underlayer film, and underlayer film, as well as resist pattern forming method and circuit pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Aug 18, 2020·2 cites·22 claims
- 0972US10364314B2Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, resist pattern forming method, circuit pattern forming method, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 30, 2019·2 cites·21 claims
- 1072US9920024B2Method for purifying compound or resinMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Mar 20, 2018·1 cites·13 claims
- 1170US11143962B2Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and production method thereof, pattern forming method, resin, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Oct 12, 2021·1 cites·17 claims
- 1262US9809601B2Compound, material for forming underlayer film for lithography, underlayer film for lithography and pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Nov 7, 2017·1 cites·16 claims
- 1359US2024367098A1Carbon dioxide absorbent, method for recovering carbon dioxide, and apparatus for separating and recovering carbon dioxideMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1457US2022144738A1Compound, resin, composition, resist pattern formation method, circuit pattern formation method, and method for purifying resinMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
- 1555US2022089810A1Polycyclic polyphenolic resin and method for producing polycyclic polyphenolic resinMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
- 1655US2022064137A1Compound, resin, composition, resist pattern formation method, circuit pattern formation method, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1754US2021206901A1Compound, composition containing the same, method for forming resist pattern and method for forming insulating filmMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1853US2022019146A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1953US2023314942A1Polycyclic polyphenolic resin, composition, method for producing polycyclic polyphenolic resin, composition for film formation, resist composition, resist pattern formation method, radiation-sensitive composition, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, circuit pattern formation method, and composition for optical member formationMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
- 2053US2021331994A1Compound, composition containing the same, method for forming resist pattern and method for forming insulating filmMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 2152US2022010072A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 2251US2020354501A1Composition for film formation for lithography, film for lithography, method for forming resist pattern, and method for forming circuit patternMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
- 2351US2021047457A1Compound, resin, composition and pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 2450US2024109997A1Resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resinMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 2550US2023333469A1Film forming composition for lithography, resist pattern formation method, and circuit pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
- 2650US2022348698A1Compound, polymer, composition, composition for film formation, pattern formation method, insulating film formation method, and method for producing compound, as well as method for producing iodine-containing vinyl polymer and acetylated derivative thereofMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
- 2748US11747728B2Compound, resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resinMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Sep 5, 2023·0 cites·18 claims
- 2848US2023296982A1Polymer, composition, method for producing polymer, composition, composition for film formation, resist composition, radiation-sensitive composition, composition for underlayer film formation for lithography, resist pattern formation method, method for producing underlayer film for lithography, circuit pattern formation method, and composition for optical member formationMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
- 2947US2008020217A1Colorless Transparent Polyimide Composite Film and Method for Producing SameMAKINOSHIMA TAKASHI·Filed 2005·Application pending·0 cites
- 3047US2023324801A1Underlayer film forming composition for lithography, underlayer film, and pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
- 3146US9828355B2Compound, material for forming underlayer film for lithography, underlayer film for lithography and pattern forming methodMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Nov 28, 2017·0 cites·10 claims
- 3246US2022260910A1Underlayer film forming composition for lithography, underlayer film for lithography, and pattern formation method and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
- 3346US2021309595A1Composition for forming optical component, optical component, compound, and resinMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 3446US2024117101A1Composition for film formation, resist composition, radiation-sensitive composition, method for producing amorphous film, resist pattern formation method, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, circuit pattern formation method, composition for optical member formation, resin for underlayer film formation, resist resin, radiation-sensitive resin, and resin for underlayer film formation for lithographyMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
- 3545US2020002307A1Method for purifying compound or resin and method for producing compositionMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
- 3644US2021018841A1Composition for resist underlayer film formation and pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 3744US2014114000A1Flameproofed alicyclic polyimide resin composition and thin-walled molded body of sameMAKINOSHIMA TAKASHI·Filed 2012·Application pending·0 cites
- 3844US2021116813A1Composition for resist underlayer film formation, underlayer film for lithography, and pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 3944US2020247739A1Compound, resin, composition, pattern formation method, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
- 4043US10310377B2Material for forming film for lithography, composition for forming film for lithography, film for lithography, pattern forming method and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted Jun 4, 2019·0 cites·17 claims
- 4143US2021294214A1Underlayer film forming compositionMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 4243US2022089811A1Composition for film formation, resist composition, radiation-sensitive composition, method for producing amorphous film, resist pattern formation method, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, and circuit pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
- 4342US10745372B2Compound, resin, material for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted Aug 18, 2020·0 cites·11 claims
- 4442US2021405529A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 4542US2021003921A1Compound, resin, composition, and film forming material for lithography using the sameMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
- 4642US2022155682A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, method for forming pattern, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
- 4742US2021165327A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 4842US2020172470A1Novel (poly)amine compound, resin and cured productMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
- 4941US2021278767A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 5040US12134596B2Compound, resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resinMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Nov 5, 2024·0 cites·20 claims
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