Inventor · disambiguated record
Hiroaki Ikegawa
Also filed as: IKEGAWA HIROAKI
18 granted patents·5 pending applications·525 citations·filing 1994–2021
92Inventor score
Top patents by PatentIndex Score
23 records- 0196US9640448B2Film forming method, film forming apparatus, and storage mediumTOKYO ELECTRON LTD·Filed 2016·Granted May 2, 2017·463 cites·8 claims
- 0289US9136133B2Method of depositing filmTOKYO ELECTRON LTD·Filed 2014·Granted Sep 15, 2015·12 cites·14 claims
- 0385US8962495B2Film deposition methodTOKYO ELECTRON LTD·Filed 2013·Granted Feb 24, 2015·9 cites·3 claims
- 0477US10438791B2Film forming method, film forming apparatus, and storage mediumTOKYO ELECTRON LTD·Filed 2018·Granted Oct 8, 2019·2 cites·7 claims
- 0573US8987147B2Method of depositing a film using a turntable apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Mar 24, 2015·3 cites·10 claims
- 0669US9252043B2Film deposition methodTOKYO ELECTRON LTD·Filed 2013·Granted Feb 2, 2016·2 cites·8 claims
- 0768US8895456B2Method of depositing a filmTOKYO ELECTRON LTD·Filed 2013·Granted Nov 25, 2014·2 cites·20 claims
- 0867US10550467B2Film formation apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Feb 4, 2020·1 cites·9 claims
- 0956US10900121B2Method of manufacturing semiconductor device and apparatus of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2017·Granted Jan 26, 2021·0 cites·4 claims
- 1056US8980371B2Film deposition methodTOKYO ELECTRON LTD·Filed 2013·Granted Mar 17, 2015·0 cites·6 claims
- 1154US12334380B2Boat transfer method and heat treatment apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jun 17, 2025·0 cites·8 claims
- 1254US5500388AHeat treatment process for wafersTOKYO ELECTRON LTD·Filed 1994·Granted Mar 19, 1996·26 cites·13 claims
- 1354US2019292662A1Film-forming method and film-forming apparatusTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 1452US7084023B2Method of manufacturing semiconductor device, film-forming apparatus, and storage mediumTOKYO ELECTRON LTD·Filed 2004·Granted Aug 1, 2006·5 cites·6 claims
- 1551US2022189785A1Method for manufacturing semiconductor device and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 1646US8921237B2Method of depositing a filmTOKYO ELECTRON LTD·Filed 2013·Granted Dec 30, 2014·0 cites·9 claims
- 1744US10550470B2Film forming apparatus and operation method of film forming apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Feb 4, 2020·0 cites·10 claims
- 1844US10297443B2Semiconductor device manufacturing method and semiconductor device manufacturing systemTOKYO ELECTRON LTD·Filed 2017·Granted May 21, 2019·0 cites·6 claims
- 1943US11171014B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Nov 9, 2021·0 cites·4 claims
- 2042US2005272271A1Semiconductor processing method for processing substrate to be processed and its apparatusTOKYO ELECTRON LTD·Filed 2004·Application pending·0 cites
- 2142US2014209028A1Film deposition apparatusTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 2238US10519550B2Film formation apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Dec 31, 2019·0 cites·5 claims
- 2333US2006216953A1Method of forming film and film forming apparatusNAKAJIMA SHIGERU·Filed 2004·Application pending·0 cites
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