Inventor · disambiguated record
Chih-Kuang Yu
Also filed as: YU CHIH-KUANG
38 granted patents·3 pending applications·310 citations·filing 2005–2025
97Inventor score
Files withTSMC SOLID STATE LIGHTING LTD8YU CHIH-KUANG8IND TECH RES INST7HSIA HSING-KUO5EPISTAR CORP3
Top patents by PatentIndex Score
41 records- 0197US8241932B1Methods of fabricating light emitting diode packagesYU CHIH-KUANG·Filed 2011·Granted Aug 14, 2012·49 cites·20 claims
- 0296US7633154B2Encapsulation and methods thereofIND TECH RES INST·Filed 2006·Granted Dec 15, 2009·53 cites·12 claims
- 0394US8653542B2Micro-interconnects for light-emitting diodesHSIA HSING-KUO·Filed 2011·Granted Feb 18, 2014·19 cites·18 claims
- 0494US8075182B2Apparatus and method for measuring characteristic and chip temperature of LEDDAI MING-JI·Filed 2008·Granted Dec 13, 2011·64 cites·22 claims
- 0592US8604491B2Wafer level photonic device die structure and method of making the sameYU CHIH-KUANG·Filed 2011·Granted Dec 10, 2013·7 cites·20 claims
- 0691US7586125B2Light emitting diode package structure and fabricating method thereofIND TECH RES INST·Filed 2006·Granted Sep 8, 2009·21 cites·17 claims
- 0790US7999172B2Flexible thermoelectric deviceIND TECH RES INST·Filed 2007·Granted Aug 16, 2011·13 cites·18 claims
- 0889US8587018B2LED structure having embedded zener diodeHSIA SHOULI STEVE·Filed 2011·Granted Nov 19, 2013·11 cites·19 claims
- 0987US8236584B1Method of forming a light emitting diode emitter substrate with highly reflective metal bondingCHEM CHYI SHYUAN·Filed 2011·Granted Aug 7, 2012·18 cites·20 claims
- 1084US9349712B2Doubled substrate multi-junction light emitting diode array structureTSMC SOLID STATE LIGHTING LTD·Filed 2015·Granted May 24, 2016·4 cites·20 claims
- 1184US8598617B2Methods of fabricating light emitting diode packagesYU CHIH-KUANG·Filed 2012·Granted Dec 3, 2013·6 cites·20 claims
- 1280US8193625B2Stacked-chip packaging structure and fabrication method thereofLIU CHUN-KAI·Filed 2009·Granted Jun 5, 2012·9 cites·9 claims
- 1377US9472714B2Dicing-free LED fabricationEPISTAR CORP·Filed 2014·Granted Oct 18, 2016·3 cites·20 claims
- 1477US8519538B2Laser etch via formationHSIA HSING-KUO·Filed 2010·Granted Aug 27, 2013·7 cites·21 claims
- 1576US9502627B2Wafer level photonic devices dies structure and method of making the sameEPISTAR CORP·Filed 2015·Granted Nov 22, 2016·1 cites·19 claims
- 1675US8609446B2Method and apparatus for accurate die-to-wafer bondingCHERN CHYI SHYUAN·Filed 2011·Granted Dec 17, 2013·3 cites·20 claims
- 1774US8415684B2LED device with improved thermal performanceHSIA HSING-KUO·Filed 2010·Granted Apr 9, 2013·3 cites·18 claims
- 1872US8993447B2LED device with improved thermal performanceTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted Mar 31, 2015·2 cites·20 claims
- 1972US8008573B2Integrated package structure having solar cell and thermoelectric element and method of fabricating the sameIND TECH RES INST·Filed 2007·Granted Aug 30, 2011·2 cites·14 claims
- 2071US8546924B2Package structures for integrating thermoelectric components with stacking chipsYU CHIH-KUANG·Filed 2010·Granted Oct 1, 2013·3 cites·16 claims
- 2171US2025298203A1Thermo-electric cooler for dissipating heat of optical engineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2270US12422635B2Thermo-electric cooler for dissipating heat of optical engineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 2369US8912033B2Dicing-free LED fabricationHSIA HSING-KUO·Filed 2010·Granted Dec 16, 2014·2 cites·20 claims
- 2465US8722436B2Method and apparatus for accurate die-to-wafer bondingTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted May 13, 2014·1 cites·20 claims
- 2564US9224932B2Wafer level photonic device die structure and method of making the sameTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted Dec 29, 2015·0 cites·15 claims
- 2664US9184334B2LED structureTSMC SOLID STATE LIGHTING LTD·Filed 2014·Granted Nov 10, 2015·0 cites·20 claims
- 2763US8962358B2Double substrate multi-junction light emitting diode array structureYU CHIH-KUANG·Filed 2011·Granted Feb 24, 2015·1 cites·21 claims
- 2862US8809899B2LED structureTSMC SOLID STATE LIGHTING LTD·Filed 2013·Granted Aug 19, 2014·0 cites·16 claims
- 2962US7517114B2Lighting devicesIND TECH RES INST·Filed 2007·Granted Apr 14, 2009·3 cites·25 claims
- 3061US9099632B2Light emitting diode emitter substrate with highly reflective metal bondingCHERN CHYI SHYUAN·Filed 2012·Granted Aug 4, 2015·1 cites·20 claims
- 3161US8242372B2Thermally conductive, electrically insulating composite film and stack chip package structure utilizing the sameLEU MING-SHENG·Filed 2010·Granted Aug 14, 2012·2 cites·20 claims
- 3260US7972877B2Fabricating method of light emitting diode packageIND TECH RES INST·Filed 2009·Granted Jul 5, 2011·1 cites·28 claims
- 3358US7855396B2Light emitting diode package structureIND TECH RES INST·Filed 2007·Granted Dec 21, 2010·1 cites·116 claims
- 3457US9287478B2Method and apparatus for accurate die-to-wafer bondingTSMC SOLID STATE LIGHTING LTD·Filed 2014·Granted Mar 15, 2016·0 cites·20 claims
- 3553US9379299B2LED device with improved thermal performanceEPISTAR CORP·Filed 2015·Granted Jun 28, 2016·0 cites·20 claims
- 3652US2014159096A1Micro-Interconnects for Light-Emitting DiodesTSMC SOLID STATE LIGHTING LTD·Filed 2014·Application pending·0 cites
- 3748US8222728B2Active solid heatsink device and fabricating method thereofYU CHIH-KUANG·Filed 2008·Granted Jul 17, 2012·0 cites·29 claims
- 3847US8415183B2Wafer level conformal coating for LED devicesHSIA HSING-KUO·Filed 2010·Granted Apr 9, 2013·0 cites·19 claims
- 3941US8519409B2Light emitting diode components integrated with thermoelectric devicesYU CHIH-KUANG·Filed 2010·Granted Aug 27, 2013·0 cites·20 claims
- 4040US2007012938A1Light-emitting-diode packaging structure having thermal-electric elementYU CHIH-KUANG·Filed 2005·Application pending·0 cites
- 4139US8188360B2Thermoelectric conversion deviceFENG SUH-YUN·Filed 2009·Granted May 29, 2012·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →