Inventor · disambiguated record
Ming-Ji Dai
Also filed as: DAI MING · DAI MING-JI
35 granted patents·9 pending applications·244 citations·filing 2006–2023
96Inventor score
Files withIND TECH RES INST22TAIN RA-MIN6MIANYANG BOE OPTOELECTRONICS TECH CO LTD5LIU CHUN-KAI4DAI MING-JI3
Top patents by PatentIndex Score
44 records- 0196US7633154B2Encapsulation and methods thereofIND TECH RES INST·Filed 2006·Granted Dec 15, 2009·53 cites·12 claims
- 0294US8075182B2Apparatus and method for measuring characteristic and chip temperature of LEDDAI MING-JI·Filed 2008·Granted Dec 13, 2011·64 cites·22 claims
- 0391US7586125B2Light emitting diode package structure and fabricating method thereofIND TECH RES INST·Filed 2006·Granted Sep 8, 2009·21 cites·17 claims
- 0490US7999172B2Flexible thermoelectric deviceIND TECH RES INST·Filed 2007·Granted Aug 16, 2011·13 cites·18 claims
- 0589US8609454B2Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devicesDAI MING-JI·Filed 2012·Granted Dec 17, 2013·20 cites·22 claims
- 0686US8552554B2Heat dissipation structure for electronic device and fabrication method thereofTAIN RA-MIN·Filed 2011·Granted Oct 8, 2013·9 cites·26 claims
- 0785US8456017B2Filled through-silicon via with conductive composite materialDAI MING-JI·Filed 2011·Granted Jun 4, 2013·10 cites·20 claims
- 0883US8674491B2Semiconductor deviceLIU CHUN-KAI·Filed 2011·Granted Mar 18, 2014·7 cites·23 claims
- 0982US9130080B2Encapsulation of backside illumination photosensitive deviceIND TECH RES INST·Filed 2013·Granted Sep 8, 2015·3 cites·7 claims
- 1081US7952368B1Apparatus and method for measuring diode chipIND TECHNOLOGY RES INSTITURE·Filed 2010·Granted May 31, 2011·8 cites·10 claims
- 1180US8193625B2Stacked-chip packaging structure and fabrication method thereofLIU CHUN-KAI·Filed 2009·Granted Jun 5, 2012·9 cites·9 claims
- 1277US8519524B1Chip stacking structure and fabricating method of the chip stacking structureWU SHENG-TSAI·Filed 2012·Granted Aug 27, 2013·6 cites·31 claims
- 1372US8008573B2Integrated package structure having solar cell and thermoelectric element and method of fabricating the sameIND TECH RES INST·Filed 2007·Granted Aug 30, 2011·2 cites·14 claims
- 1471US8278755B2Heat dissipation structure for electronic device and fabrication method thereofTAIN RA-MIN·Filed 2010·Granted Oct 2, 2012·3 cites·26 claims
- 1570US10343868B2Roller with pressure sensor and R to R deviceIND TECH RES INST·Filed 2016·Granted Jul 9, 2019·1 cites·9 claims
- 1669US10288696B2Intelligent diagnosis system for power module and method thereofIND TECH RES INST·Filed 2016·Granted May 14, 2019·1 cites·18 claims
- 1767US8502224B2Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensorTAIN RA-MIN·Filed 2010·Granted Aug 6, 2013·2 cites·19 claims
- 1866US8310037B2Light emitting apparatus and fabrication method thereofLIU CHUN-KAI·Filed 2009·Granted Nov 13, 2012·2 cites·36 claims
- 1965US9448121B2Measurement method, measurement apparatus, and computer program productIND TECH RES INST·Filed 2013·Granted Sep 20, 2016·2 cites·49 claims
- 2065US8664509B2Thermoelectric apparatus and method of fabricating the sameLIU CHUN-KAI·Filed 2011·Granted Mar 4, 2014·2 cites·17 claims
- 2162US7517114B2Lighting devicesIND TECH RES INST·Filed 2007·Granted Apr 14, 2009·3 cites·25 claims
- 2260US7972877B2Fabricating method of light emitting diode packageIND TECH RES INST·Filed 2009·Granted Jul 5, 2011·1 cites·28 claims
- 2358US8536701B2Electronic device packaging structureTAIN RA-MIN·Filed 2012·Granted Sep 17, 2013·1 cites·12 claims
- 2458US7855396B2Light emitting diode package structureIND TECH RES INST·Filed 2007·Granted Dec 21, 2010·1 cites·116 claims
- 2557US2023367306A1Method and apparatus for equipment anomaly detectionIND TECH RES INST·Filed 2023·Application pending·0 cites
- 2656US11586315B2Display substrate, display device and method of manufacturing sameMIANYANG BOE OPTOELECTRONICS TECH CO LTD·Filed 2022·Granted Feb 21, 2023·0 cites·18 claims
- 2752US2016163950A1Structure of thermoelectric module and fabricating method thereofIND TECH RES INST·Filed 2014·Application pending·0 cites
- 2851US8288655B2Circuit board structure and manufacturing method thereofTAIN RA-MIN·Filed 2008·Granted Oct 16, 2012·0 cites·20 claims
- 2950US11243520B2Human-machine interface system and communication control device thereofIND TECH RES INST·Filed 2019·Granted Feb 8, 2022·0 cites·16 claims
- 3050US2018033772A1Semiconductor device having a rib structure and manufacturing method of the sameIND TECH RES INST·Filed 2017·Application pending·0 cites
- 3149US2018040798A1Structure of thermoelectric module and fabricating method thereofIND TECH RES INST·Filed 2017·Application pending·0 cites
- 3248US11392235B2Display substrate, method for manufacturing the same, and display deviceMIANYANG BOE OPTOELECTRONICS TECH CO LTD·Filed 2021·Granted Jul 19, 2022·0 cites·20 claims
- 3348US8222728B2Active solid heatsink device and fabricating method thereofYU CHIH-KUANG·Filed 2008·Granted Jul 17, 2012·0 cites·29 claims
- 3447US10540474B2Chip temperature computation method and chip temperature computation deviceIND TECH RES INST·Filed 2018·Granted Jan 21, 2020·0 cites·15 claims
- 3547US2017170146A1Semiconductor device and manufacturing method of the sameIND TECH RES INST·Filed 2015·Application pending·0 cites
- 3646US2022114419A1Classification device and classification method based on neural networkIND TECH RES INST·Filed 2020·Application pending·0 cites
- 3745US12429914B2Flexible display device and electronic deviceMIANYANG BOE OPTOELECTRONICS TECH CO LTD·Filed 2021·Granted Sep 30, 2025·0 cites·20 claims
- 3845US11366537B2Substrate including touch structure layer, manufacturing method thereof and display deviceMIANYANG BOE OPTOELECTRONICS TECH CO LTD·Filed 2020·Granted Jun 21, 2022·0 cites·18 claims
- 3944US8507909B2Measuring apparatus that includes a chip with a through silicon via, a heater having plural switches, and a stress sensorTAIN RA-MIN·Filed 2011·Granted Aug 13, 2013·0 cites·28 claims
- 4042US2013234325A1Filled through-silicon via and the fabrication method thereofIND TECH RES INST·Filed 2013·Application pending·0 cites
- 4142US2012249176A1Test structure and measurement method thereofCHIEN HENG-CHIEH·Filed 2011·Application pending·0 cites
- 4240US11532679B2Method of fabricating array substrate, array substrate, and display apparatusMIANYANG BOE OPTOELECTRONICS TECH CO LTD·Filed 2019·Granted Dec 20, 2022·0 cites·17 claims
- 4338US11132786B2Board defect filtering method based on defect list and circuit layout image and device thereof and computer-readable recording mediumIND TECH RES INST·Filed 2018·Granted Sep 28, 2021·0 cites·9 claims
- 4434US2018129763A1Method of manufacturing foot auxiliary equpimentIND TECH RES INST·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →