Inventor · disambiguated record
Martin Schrems
Also filed as: SCHREMS MARTIN · SCHREMS MARTIN E
73 granted patents·9 pending applications·1,367 citations·filing 1995–2022
99Inventor score
Files withAMS AG23INFINEON TECHNOLOGIES AG23SIEMENS AG11AUSTRIAMICROSYSTEMS AG4AT & S AUSTRIA TECH & SYSTEMTECHNIK AG3
Top patents by PatentIndex Score
82 records- 0195US6008104AMethod of fabricating a trench capacitor with a deposited isolation collarSIEMENS AG·Filed 1998·Granted Dec 28, 1999·123 cites·17 claims
- 0294US9684074B2Optical sensor arrangement and method of producing an optical sensor arrangementAMS AG·Filed 2014·Granted Jun 20, 2017·18 cites·14 claims
- 0393US8378496B2Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connectionAUSTRIAMICROSYSTEMS AG·Filed 2008·Granted Feb 19, 2013·27 cites·17 claims
- 0493US6699747B2Method for increasing the capacitance in a storage trenchINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 2, 2004·117 cites·14 claims
- 0593US6018174ABottle-shaped trench capacitor with epi buried layerSIEMENS AG·Filed 1998·Granted Jan 25, 2000·114 cites·10 claims
- 0690US6200873B1Production method for a trench capacitor with an insulation collarSIEMENS AG·Filed 1999·Granted Mar 13, 2001·76 cites·14 claims
- 0790US5945704ATrench capacitor with epi buried layerSIEMENS AG·Filed 1998·Granted Aug 31, 1999·86 cites·10 claims
- 0889US9577001B2Integrated imaging device for infrared radiation and method of productionAMS AG·Filed 2014·Granted Feb 21, 2017·10 cites·27 claims
- 0987US9735101B2Semiconductor device with through-substrate via covered by a solder ballAMS AG·Filed 2016·Granted Aug 15, 2017·4 cites·6 claims
- 1086US6465370B1Low leakage, low capacitance isolation materialINFINEON TECHNOLOGIES AG·Filed 1998·Granted Oct 15, 2002·79 cites·16 claims
- 1186US6310375B1Trench capacitor with isolation collar and corresponding manufacturing methodSIEMENS AG·Filed 1998·Granted Oct 30, 2001·55 cites·6 claims
- 1285US6580118B2Non-volatile semiconductor memory cell having a metal oxide dielectric, and method for fabricating the memory cellINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 17, 2003·36 cites·14 claims
- 1385US6319788B1Semiconductor structure and manufacturing methodsINFINEON TECHNOLOGIES CORP·Filed 1999·Granted Nov 20, 2001·58 cites·7 claims
- 1483US6828191B1Trench capacitor with an insulation collar and method for producing a trench capacitorSIEMENS AG·Filed 1999·Granted Dec 7, 2004·53 cites·8 claims
- 1580US9870988B2Method of producing a semiconductor device with through-substrate via covered by a solder ballAMS AG·Filed 2017·Granted Jan 16, 2018·2 cites·7 claims
- 1679US6265741B1Trench capacitor with epi buried layerSIEMENS AG·Filed 1998·Granted Jul 24, 2001·41 cites·8 claims
- 1778US9553039B2Semiconductor device with through-substrate via covered by a solder ball and related method of productionAMS AG·Filed 2012·Granted Jan 24, 2017·3 cites·6 claims
- 1878US8338898B2Micro electro mechanical system (MEMS) microphone having a thin-film constructionSCHRANK FRANZ·Filed 2005·Granted Dec 25, 2012·9 cites·7 claims
- 1978US6509599B1Trench capacitor with insulation collar and method for producing the trench capacitorSIEMENS AG·Filed 1999·Granted Jan 21, 2003·41 cites·5 claims
- 2077US6580110B2Trench capacitor and method for fabricating a trench capacitorINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 17, 2003·14 cites·6 claims
- 2177US6500707B2Method for manufacturing a trench capacitor of a memory cell of a semiconductor memoryINFINEON TECHNOLOGIES AG·Filed 2002·Granted Dec 31, 2002·18 cites·11 claims
- 2276US11452199B2Electronic module with single or multiple components partially surrounded by a thermal decoupling gapAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Sep 20, 2022·2 cites·20 claims
- 2376US6608341B2Trench capacitor with capacitor electrodesINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 19, 2003·16 cites·9 claims
- 2476US5516283AApparatus for processing a plurality of circular wafersTOSHIBA KK·Filed 1995·Granted May 14, 1996·47 cites·53 claims
- 2575US6177696B1Integration scheme enhancing deep trench capacitance in semiconductor integrated circuit devicesIBM·Filed 1998·Granted Jan 23, 2001·44 cites·33 claims
- 2674US6750111B2Method for fabricating a trench capacitorINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 15, 2004·12 cites·40 claims
- 2773US10283541B2Semiconductor device comprising an aperture array and method of producing such a semiconductor deviceAMS AG·Filed 2015·Granted May 7, 2019·2 cites·27 claims
- 2873US8502308B2Semiconductor device with a trench isolation and method of manufacturing trenches in a semiconductor bodySCHREMS MARTIN·Filed 2007·Granted Aug 6, 2013·8 cites·11 claims
- 2973US6750096B2Trench capacitor with buried plate and method for its productionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 15, 2004·17 cites·10 claims
- 3073US6528384B2Method for manufacturing a trench capacitorINFINEON TECHNOLOGIES AG·Filed 2001·Granted Mar 4, 2003·20 cites·14 claims
- 3172US11888010B2System-on-chip camera with integrated light sensor(s) and method of producing a system-on-chip cameraAMS AG·Filed 2022·Granted Jan 30, 2024·0 cites·10 claims
- 3271US9947711B2Semiconductor device with surface integrated focusing element and method of producing a semiconductor device with focusing elementAMS AG·Filed 2015·Granted Apr 17, 2018·2 cites·16 claims
- 3371US6828192B2Semiconductor memory cell and method for fabricating the memory cellINFINEON TECHNOLOGIES AG·Filed 2003·Granted Dec 7, 2004·14 cites·21 claims
- 3471US6537926B1Process for improving the thickness uniformity of a thin oxide layer in semiconductor wafer fabricationINFINEON TECHNOLOGIES AG·Filed 2000·Granted Mar 25, 2003·12 cites·21 claims
- 3570US8383488B2Method for producing a semiconductor component with two trenchesAUSTRIAMICROSYSTEMS AG·Filed 2007·Granted Feb 26, 2013·3 cites·10 claims
- 3668US9543245B2Semiconductor sensor device and method of producing a semiconductor sensor deviceAMS AG·Filed 2013·Granted Jan 10, 2017·2 cites·9 claims
- 3768US2022221363A1Pressure Sensor Device and Method for Forming a Pressure Sensor DeviceSCIOSENSE BV·Filed 2022·Application pending·0 cites
- 3867US11201119B2RF functionality and electromagnetic radiation shielding in a component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Dec 14, 2021·1 cites·19 claims
- 3967US10374114B2Lateral single-photon avalanche diode and method of producing a lateral single-photon avalanche diodeAMS AG·Filed 2014·Granted Aug 6, 2019·2 cites·8 claims
- 4066US6677218B2Method for filling trenches in integrated semiconductor circuitsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 13, 2004·10 cites·27 claims
- 4163US10256147B2Dicing methodAMS AG·Filed 2015·Granted Apr 9, 2019·1 cites·5 claims
- 4262US11313749B2Pressure sensor device and method for forming a pressure sensor deviceSCIOSENSE BV·Filed 2017·Granted Apr 26, 2022·0 cites·9 claims
- 4362US9929035B2Method of producing a removable wafer connection and carrier for wafer supportAMS AG·Filed 2013·Granted Mar 27, 2018·1 cites·4 claims
- 4462US6664167B2Memory with trench capacitor and selection transistor and method for fabricating itINFINEON TECHNOLOGIES AG·Filed 2002·Granted Dec 16, 2003·9 cites·24 claims
- 4561US11411035B2System-on-chip camera with integrated light sensor(s) and method of producing a system-on-chip cameraAMS AG·Filed 2017·Granted Aug 9, 2022·0 cites·18 claims
- 4661US7820342B2Multiple mask and method for producing differently doped regionsAUSTRIAMICROSYSTEMS AG·Filed 2005·Granted Oct 26, 2010·1 cites·9 claims
- 4761US6376348B1Reliable polycide gate stack with reduced sheet resistance and thicknessSIEMENS AG·Filed 1997·Granted Apr 23, 2002·20 cites·16 claims
- 4861US6326262B1Method for fabricating epitaxy layerINFINEON TECHNOLOGIES AG·Filed 2000·Granted Dec 4, 2001·8 cites·10 claims
- 4960US6777303B2Method for fabricating an insulation collar in a trench capacitorINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 17, 2004·11 cites·20 claims
- 5060US6548850B1Trench capacitor configuration and method of producing itINFINEON TECHNOLOGIES AG·Filed 2000·Granted Apr 15, 2003·8 cites·18 claims
Showing the top 50 of 82 patent records by PatentIndex Score.
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