Inventor
LEE HO-JIN
KR184 patents
⚠️ This page may combine multiple inventors who share the name “LEE HO-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS9941243B2Apr 10, 2018
Wafer-to-wafer bonding structure
SAMSUNG ELECTRONICS CO LTD237 citations99
US10577199B2Mar 3, 2020
Robot cleaner, refrigerator, container transfer system, and method of transferring and retrieving container using the robot cleaner
SAMSUNG ELECTRONICS CO LTD20 citations93
US7572673B2Aug 11, 2009
Wafer level package having a stress relief spacer and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD18 citations92
US10468400B2Nov 5, 2019
Method of manufacturing substrate structure
SAMSUNG ELECTRONICS CO LTD8 citations84
US10325869B2Jun 18, 2019
Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
SAMSUNG ELECTRONICS CO LTD6 citations84
US9935037B2Apr 3, 2018
Multi-stacked device having TSV structure
SAMSUNG ELECTRONICS CO LTD13 citations84
US9824973B2Nov 21, 2017
Integrated circuit devices having through-silicon via structures and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD7 citations84
US9343361B2May 17, 2016
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device
SAMSUNG ELECTRONICS CO LTD11 citations84
US8941216B2Jan 27, 2015
Semiconductor devices having through-vias and methods for fabricating the same
SAMSUNG ELECTRONICS CO LTD7 citations84
US7875552B2Jan 25, 2011
Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby
SAMSUNG ELECTRONICS CO LTD7 citations84
US7777345B2Aug 17, 2010
Semiconductor device having through electrode and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US9530706B2Dec 27, 2016
Semiconductor devices having hybrid stacking structures and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD13 citations83
US8927426B2Jan 6, 2015
Semiconductor devices having through-vias and methods for fabricating the same
SAMSUNG ELECTRONICS CO LTD10 citations83
US9806004B2Oct 31, 2017
Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping pad
SAMSUNG ELECTRONICS CO LTD8 citations82
US8362621B2Jan 29, 2013
Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD14 citations82
US10325897B2Jun 18, 2019
Method for fabricating substrate structure and substrate structure fabricated by using the method
SAMSUNG ELECTRONICS CO LTD4 citations73
KOREA ELECTRONICS TELECOMM
12 patentsUS7616710B2Nov 10, 2009
Frequency offset estimating method and receiver employing the same
KOREA ELECTRONICS TELECOMM57 citations95
US7324465B2Jan 29, 2008
Random access channel access apparatus for mobile satellite communication system and method therefor
KOREA ELECTRONICS TELECOMM47 citations92
US6925132B2Aug 2, 2005
Method for detecting and correcting amplitude and phase imbalances between I and Q components in quadrature demodulator
KOREA ELECTRONICS TELECOMM33 citations92
US6802037B2Oct 5, 2004
Iterative decoding method for block turbo codes of greater than three dimensions
KOREA ELECTRONICS TELECOMM22 citations92
US5721810AFeb 24, 1998
Method of automatically controlling and verifying telecommands in satellite control system
KOREA ELECTRONICS TELECOMM21 citations88
US7346069B2Mar 18, 2008
Apparatus and method for dynamic resource allocation in interactive satellite multimedia system
KOREA ELECTRONICS TELECOMM13 citations84
US7310387B2Dec 18, 2007
Apparatus for compensating DC offsets, gain and phase imbalances between I-channel and Q-channel in quadrature transceiving system
KOREA ELECTRONICS TELECOMM14 citations84
US7187725B2Mar 6, 2007
Method and apparatus for compensating I/Q imbalance by using variable loop gain in quadrature demodulator
KOREA ELECTRONICS TELECOMM15 citations84
US8049319B2Nov 1, 2011
Ultra wideband system-on-package
KOREA ELECTRONICS TELECOMM7 citations83
US7940713B2May 10, 2011
Apparatus and method for traffic performance improvement and traffic security in interactive satellite communication system
KOREA ELECTRONICS TELECOMM10 citations82
US7248654B2Jul 24, 2007
Apparatus and method for compensating I/Q imbalance based on gain-controlled reference channel in orthogonal frequency division multiplex
KOREA ELECTRONICS TELECOMM8 citations74
US6909888B2Jun 21, 2005
System for estimating traffic rate of calls in wireless personal communication environment and method for the same
KOREA ELECTRONICS TELECOMM9 citations74
LEE HO-JIN
10 patentsUS8592991B2Nov 26, 2013
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device
LEE HO-JIN31 citations92
US8592988B2Nov 26, 2013
Semiconductor device
LEE HO-JIN19 citations91
US9859191B2Jan 2, 2018
Semiconductor device including conductive via with buffer layer at tapered portion of conductive via
LEE HO-JIN12 citations84
US8952543B2Feb 10, 2015
Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices
LEE HO-JIN15 citations84
US8335255B2Dec 18, 2012
Motion estimation method, medium, and system with fast motion estimation
LEE HO-JIN13 citations84
US9171753B2Oct 27, 2015
Semiconductor devices having conductive via structures and methods for fabricating the same
LEE HO-JIN7 citations83
US8637989B2Jan 28, 2014
Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes
LEE HO-JIN9 citations83
US8492902B2Jul 23, 2013
Multi-layer TSV insulation and methods of fabricating the same
LEE HO-JIN8 citations83
US8415804B2Apr 9, 2013
Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
LEE HO-JIN7 citations83
US9852965B2Dec 26, 2017
Semiconductor devices with through electrodes and methods of fabricating the same
LEE HO-JIN6 citations73
DAEWOO ELECTRONICS CO LTD
1 patentUTSTARCOM INC
1 patentHYUNDAI MOTOR CO LTD
1 patentLEE HO JIN
1 patentCHUNG HYUN-SOO
1 patentLEE IN KI
1 patentKT CORP
1 patentNAVER BUSINESS PLATFORM CORP
1 patentYOU BYOUNG-GAE
1 patentNAM SEUNG HYUN
1 patentKWAK CHANGSOO
1 patentELECTRONICS & TELECOMMUNICATIONS RES INST
1 patentShowing the top 50 of 184 patents by PatentIndex Score.