Inventor · disambiguated record
Jia Lin Yap
Also filed as: YAP JIA LIN
3 granted patents·5 pending applications·5 citations·filing 2013–2014
57Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0156US8933547B1Lead frame with power bar for semiconductor deviceYAP JIA LIN·Filed 2013·Granted Jan 13, 2015·2 cites·19 claims
- 0256US8853840B2Semiconductor package with inner and outer leadsAU YIN KHENG·Filed 2013·Granted Oct 7, 2014·3 cites·11 claims
- 0343US9257403B2Copper ball bond interface structure and formationFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Feb 9, 2016·0 cites·20 claims
- 0430US2014263584A1Wire bonding apparatus and methodYAP JIA LIN·Filed 2013·Application pending·0 cites
- 0529US2015075849A1Semiconductor device and lead frame with interposerYAP JIA LIN·Filed 2013·Application pending·0 cites
- 0629US2014374467A1Capillary bonding tool and method of forming wire bondsYAP JIA LIN·Filed 2013·Application pending·0 cites
- 0728US2015206829A1Semiconductor package with interior leadsAU YIN KHENG·Filed 2014·Application pending·0 cites
- 0828US2014374151A1Wire bonding method for flexible substratesYAP JIA LIN·Filed 2013·Application pending·0 cites
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