Inventor

SUH DAEWOONG

US98 patents

⚠️ This page may combine multiple inventors who share the name “SUH DAEWOONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUH DAEWOONG

SEOUL VIOSYS CO LTD

Wafer level light-emitting diode array

Wafer level light-emitting diode array

Wafer level light-emitting diode array

Light emitting diode, method of fabricating the same and LED module having the same

Light-emitting device and method of manufacturing the same

Light emitting diode and method of manufacturing the same

Electronic device comprising semiconductor memory having ohmic-contact structure separated from current distributing layer

Wafer level light-emitting diode array and method for manufacturing same

Light-emitting device and method of manufacturing the same

Wafer level LED package and method of fabricating the same

Sterilizing apparatus for portable terminal

Wafer level light-emitting diode array

Wafer level light-emitting diode array

Light emitting diode, method of fabricating the same and led module having the same

Light emitting diode and light emitting diode package

Light emitting diode, method of fabricating the same and LED module having the same

Light-emitting diode and application therefor

Light emitting diode and light emitting diode package

Light emitting diode

Light emitting diode and method of manufacturing the same

Light emitting diode and LED module having the same

Method of fabricating light emitting device through forming a template for growing semiconductor and separating growth substrate

Light emitting diode, method of fabricating the same and LED module having the same

Light-emitting diode and application therefor

Light-emitting diode and application therefor

Light-emitting diode module having light-emitting diode joined through solder paste and light-emitting diode

Light-emitting device and method of manufacturing the same

Wafer level light-emitting diode array

Light emitting diode, method of fabricating the same and LED module having the same

Water purification system using ultraviolet LEDs

Light-emitting diode module having light-emitting diode joined through solder paste and light-emitting diode

Light emitting device having wide beam angle and method of fabricating the same

INTEL CORP

Methods and apparatuses for providing stacked-die devices

Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance

Nanostructure-based package interconnect

Solder joint reliability in microelectronic packaging

Sintered metallic thermal interface materials for microelectronic cooling assemblies

Microelectronic package interconnect and method of fabrication thereof

Intermetallic solder with low melting point

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Carbon nanotube coated capacitor electrodes

Soldering an electronics package to a motherboard

Bulk metallic glass solder material

Microelectronic package interconnect and method of fabrication thereof

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

RENAVIKAR MUKUL

Forming a semiconductor package including a thermal interface material

CALIFORNIA INST OF TECHN

Process for joining materials using bulk metallic glasses

HOULE SABINA

Microelectronic package with high temperature thermal interface material

SUH DAEWOONG

Methods and apparatuses for providing stacked-die devices