Inventor · disambiguated record
Mitsuru Kimura
Also filed as: KIMURA MITSURU
11 granted patents·2 pending applications·287 citations·filing 1984–2020
92Inventor score
Files withNEC CORP10INSTITUTION FOR A GLOBAL SOC K K1TAMAGAWA SEIKI CO LTD1UNIV KYUSHU NAT UNIV CORP1
Top patents by PatentIndex Score
13 records- 0180US4874721AMethod of manufacturing a multichip package with increased adhesive strengthNEC CORP·Filed 1988·Granted Oct 17, 1989·66 cites·2 claims
- 0277US5545281AMethod of bonding circuit boardsNEC CORP·Filed 1994·Granted Aug 13, 1996·50 cites·11 claims
- 0375US5714112AProcess for producing a silica sintered product for a multi-layer wiring substrateNEC CORP·Filed 1995·Granted Feb 3, 1998·43 cites·4 claims
- 0475US5318651AMethod of bonding circuit boardsNEC CORP·Filed 1992·Granted Jun 7, 1994·46 cites·1 claims
- 0569US5576518AVia-structure of a multilayer interconnection ceramic substrateNEC CORP·Filed 1995·Granted Nov 19, 1996·37 cites·20 claims
- 0653US6746490B2Winding method and structure for stator coilsTAMAGAWA SEIKI CO LTD·Filed 2002·Granted Jun 8, 2004·5 cites·5 claims
- 0752US4594473ASubstrate having at least one fine-wired conductive layerNEC CORP·Filed 1984·Granted Jun 10, 1986·15 cites·6 claims
- 0844US2022251639A1Oligonucleotide, omics analysis method, and omics analysis kitUNIV KYUSHU NAT UNIV CORP·Filed 2020·Application pending·0 cites
- 0939US5506058AMutlilayer glass ceramic substrate and method of fabricating the sameNEC CORP·Filed 1994·Granted Apr 9, 1996·10 cites·8 claims
- 1039US5485352AElement joining pad for semiconductor device mounting boardNEC CORP·Filed 1994·Granted Jan 16, 1996·9 cites·9 claims
- 1134US5728470AMulti-layer wiring substrate, and process for producing the sameNEC CORP·Filed 1995·Granted Mar 17, 1998·4 cites·6 claims
- 1231US5757062ACeramic substrate for semiconductor deviceNEC CORP·Filed 1997·Granted May 26, 1998·2 cites·16 claims
- 1331US2020005167A1Subconscious estimation system, subconscious estimation method, and subconscious estimation programINSTITUTION FOR A GLOBAL SOC K K·Filed 2016·Application pending·0 cites
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