Inventor · disambiguated record
Kyong Hwan Koh
Also filed as: KOH KYONG HWAN
6 granted patents·3 pending applications·1 citations·filing 2020–2025
69Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0178US11107769B2Semiconductor package and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 31, 2021·1 cites·20 claims
- 0274US11996365B2Semiconductor package and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 28, 2024·0 cites·15 claims
- 0370US11610845B2Semiconductor package and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·19 claims
- 0470US2024347401A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0568US12132007B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·18 claims
- 0662US11581266B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·15 claims
- 0759US12057357B2Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recessesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·18 claims
- 0856US2024178188A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0947US2025349570A1Semiconductor package molding apparatus, semiconductor package molding system and semiconductor molding methodSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →