Inventor · disambiguated record
Hiroaki Ichinohe
Also filed as: ICHINOHE HIROAKI
6 granted patents·3 citations·filing 2016–2018
68Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP6
Top patents by PatentIndex Score
6 records- 0172US11538728B2Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrierMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Dec 27, 2022·2 cites·10 claims
- 0259US11121099B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 14, 2021·1 cites·5 claims
- 0342US11393778B2Semiconductor device and antenna deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 19, 2022·0 cites·20 claims
- 0442US11309231B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Apr 19, 2022·0 cites·14 claims
- 0541US11335619B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted May 17, 2022·0 cites·16 claims
- 0634US10211116B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 19, 2019·0 cites·5 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →