Inventor · disambiguated record
Harmeet Singh
Also filed as: SINGH HARMEET
132 granted patents·34 pending applications·2,735 citations·filing 1996–2025
99Inventor score
Top patents by PatentIndex Score
166 records- 0199US8617411B2Methods and apparatus for atomic layer etchingSINGH HARMEET·Filed 2011·Granted Dec 31, 2013·574 cites·19 claims
- 0298US9805941B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2017·Granted Oct 31, 2017·44 cites·26 claims
- 0398US9576811B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2015·Granted Feb 21, 2017·65 cites·26 claims
- 0498US9257638B2Method to etch non-volatile metal materialsLAM RES CORP·Filed 2014·Granted Feb 9, 2016·55 cites·18 claims
- 0598US9017526B2Ion beam etching systemLAM RES CORP·Filed 2013·Granted Apr 28, 2015·48 cites·19 claims
- 0698US8884194B2Heating plate with planar heater zones for semiconductor processingLAM RES CORP·Filed 2013·Granted Nov 11, 2014·52 cites·20 claims
- 0798US8637794B2Heating plate with planar heating zones for semiconductor processingSINGH HARMEET·Filed 2009·Granted Jan 28, 2014·86 cites·15 claims
- 0898US8546732B2Heating plate with planar heater zones for semiconductor processingSINGH HARMEET·Filed 2010·Granted Oct 1, 2013·75 cites·12 claims
- 0998US7932181B2Edge gas injection for critical dimension uniformity improvementLAM RES CORP·Filed 2006·Granted Apr 26, 2011·185 cites·19 claims
- 1097US10197908B2Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling frameworkLAM RES CORP·Filed 2016·Granted Feb 5, 2019·27 cites·32 claims
- 1197US10186426B2Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)LAM RES CORP·Filed 2017·Granted Jan 22, 2019·16 cites·21 claims
- 1297US10056225B2Adjusting substrate temperature to improve CD uniformityLAM RES CORP·Filed 2013·Granted Aug 21, 2018·36 cites·11 claims
- 1397US9390893B2Sub-pulsing during a stateLAM RES CORP·Filed 2014·Granted Jul 12, 2016·35 cites·19 claims
- 1497US9257295B2Ion beam etching systemLAM RES CORP·Filed 2015·Granted Feb 9, 2016·20 cites·20 claims
- 1597US9130158B1Method to etch non-volatile metal materialsLAM RES CORP·Filed 2014·Granted Sep 8, 2015·44 cites·19 claims
- 1697US8791392B2Methods of fault detection for multiplexed heater arraySINGH HARMEET·Filed 2010·Granted Jul 29, 2014·35 cites·13 claims
- 1796US9368329B2Methods and apparatus for synchronizing RF pulses in a plasma processing systemVALCORE JR JOHN C·Filed 2012·Granted Jun 14, 2016·24 cites·27 claims
- 1896US9245761B2Internal plasma grid for semiconductor fabricationLAM RES CORP·Filed 2013·Granted Jan 26, 2016·21 cites·19 claims
- 1996US8900402B2Semiconductor processing system having multiple decoupled plasma sourcesHOLLAND JOHN PATRICK·Filed 2011·Granted Dec 2, 2014·38 cites·20 claims
- 2096US8680441B2Heating plate with planar heater zones for semiconductor processingLAM RES CORP·Filed 2013·Granted Mar 25, 2014·24 cites·14 claims
- 2195US10403475B2Tunable multi-zone gas injection systemLAM RES CORP·Filed 2015·Granted Sep 3, 2019·13 cites·16 claims
- 2295US9997333B2Sub-pulsing during a stateLAM RES CORP·Filed 2017·Granted Jun 12, 2018·11 cites·20 claims
- 2395US9812294B2Sub-pulsing during a stateLAM RES CORP·Filed 2016·Granted Nov 7, 2017·11 cites·20 claims
- 2495US9392643B2Heating plate with planar heater zones for semiconductor processingLAM RES CORP·Filed 2013·Granted Jul 12, 2016·12 cites·21 claims
- 2595US9101038B2Electrostatic chuck including declamping electrode and method of declampingLAM RES CORP·Filed 2013·Granted Aug 4, 2015·60 cites·20 claims
- 2695US8642480B2Adjusting substrate temperature to improve CD uniformityGAFF KEITH WILLIAM·Filed 2010·Granted Feb 4, 2014·22 cites·16 claims
- 2795US7204913B1In-situ pre-coating of plasma etch chamber for improved productivity and chamber condition controlLAM RES CORP·Filed 2003·Granted Apr 17, 2007·92 cites·6 claims
- 2894USD912492SLock setALTRO SMART INC·Filed 2019·Granted Mar 9, 2021·36 cites·1 claims
- 2994US10585347B2Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling frameworkLAM RES CORP·Filed 2018·Granted Mar 10, 2020·9 cites·21 claims
- 3094US10515816B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2018·Granted Dec 24, 2019·6 cites·18 claims
- 3194US10236193B2Substrate supports with multi-layer structure including independent operated heater zonesLAM RES CORP·Filed 2017·Granted Mar 19, 2019·6 cites·20 claims
- 3294US10141163B2Controlling ion energy within a plasma chamberLAM RES CORP·Filed 2016·Granted Nov 27, 2018·8 cites·20 claims
- 3394US9177756B2E-beam enhanced decoupled source for semiconductor processingHOLLAND JOHN PATRICK·Filed 2012·Granted Nov 3, 2015·23 cites·19 claims
- 3493US11886304B2Making transmission control protocol (TCP) sessions robust in a socket replication environmentJUNIPER NETWORKS INC·Filed 2022·Granted Jan 30, 2024·2 cites·20 claims
- 3593USD947000SLock setALTRO SMART INC·Filed 2021·Granted Mar 29, 2022·6 cites·1 claims
- 3693US10224221B2Internal plasma grid for semiconductor fabricationLAM RES CORP·Filed 2016·Granted Mar 5, 2019·7 cites·20 claims
- 3793US9460894B2Controlling ion energy within a plasma chamberLAM RES CORP·Filed 2013·Granted Oct 4, 2016·11 cites·20 claims
- 3893US7767584B1In-situ pre-coating of plasma etch chamber for improved productivity and chamber condition controlLAM RES CORP·Filed 2007·Granted Aug 3, 2010·45 cites·7 claims
- 3993US7366364B2Optical multiplexerJDS UNIPHASE CORP·Filed 2007·Granted Apr 29, 2008·36 cites·13 claims
- 4093US6776851B1In-situ cleaning of a polymer coated plasma processing chamberLAM RES CORP·Filed 2002·Granted Aug 17, 2004·49 cites·13 claims
- 4193US6056436ASimultaneous measurement of temperature and strain using optical sensorsUNIV MARYLAND·Filed 1998·Granted May 2, 2000·121 cites·24 claims
- 4292US10720346B2Substrate support with thermal zones for semiconductor processingLAM RES CORP·Filed 2016·Granted Jul 21, 2020·5 cites·25 claims
- 4392US9646861B2Heating plate with heating zones for substrate processing and method of use thereofLAM RES CORP·Filed 2013·Granted May 9, 2017·7 cites·25 claims
- 4492US9051647B2Tunable multi-zone gas injection systemCOOPERBERG DAVID J·Filed 2009·Granted Jun 9, 2015·36 cites·12 claims
- 4591US8520360B2Electrostatic chuck with wafer backside plasma assisted dechuckSINGH HARMEET·Filed 2011·Granted Aug 27, 2013·11 cites·19 claims
- 4690US11902404B1Retaining key parameters after a transmission control protocol (TCP) session flapJUNIPER NETWORKS INC·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 4790US6947639B2Integrated polarization couplerOPTOVIA CORP·Filed 2002·Granted Sep 20, 2005·45 cites·25 claims
- 4889US12141780B2Mobile device transaction processing system and method using LoRaWAN communicationsBANK OF AMERICA·Filed 2022·Granted Nov 12, 2024·2 cites·20 claims
- 4989US12105856B2Validation and registration for information handling systemsDELL PRODUCTS LP·Filed 2021·Granted Oct 1, 2024·2 cites·17 claims
- 5089US10256077B2Sub-pulsing during a stateLAM RES CORP·Filed 2018·Granted Apr 9, 2019·4 cites·32 claims
Showing the top 50 of 166 patent records by PatentIndex Score.
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